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Journal of Electronic Materials
Published in: Journal of Electronic Materials 1/2023

07-11-2022 | Original Research Article

Hot Extruded Bulk Polycrystalline (Bi1-xSbx)2(Te1-ySey)3 Alloys: Electron Transport and Lattice Thermal Conductivity

Authors: Remo A. Masut, Cédric André, Dimitri Vasilevskiy

Published in: Journal of Electronic Materials | Issue 1/2023

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Abstract

Hot extruded bulk polycrystalline n-type (Bi1-xSbx)2(Te1-ySey)3 quaternary alloys with low Sb and Se concentrations (< 10%) are anisotropic materials by virtue of their texture which is a result of severe shearing involved in the extrusion process. Harman-type measurements have provided the electrical and thermal conductivity, Seebeck coefficient, and thermoelectric figure of merit parallel to the extrusion axis, as a function of temperature, in the range ~ 220–420 K. Mobility and carrier concentration were determined by Hall effect measurements along a plane perpendicular to the extrusion axis in the range 15–420 K. Modeling the electronic transport properties allows the determination of the total (including thermodiffusion) electronic contribution to the thermal conductivity. Thus, the lattice thermal conductivity \(\kappa_{\parallel }^{{}}\), along the extrusion axis, can be obtained with a reasonable degree of accuracy in the range 220–380 K. The results carry a rather large relative uncertainty at higher temperatures as \(\kappa_{\parallel }^{{}}\) decreases with increasing temperature with a tendency which mimics that observed for the crystalline base compound Bi2Te3.
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Appendix
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Metadata
Title
Hot Extruded Bulk Polycrystalline (Bi1-xSbx)2(Te1-ySey)3 Alloys: Electron Transport and Lattice Thermal Conductivity
Authors
Remo A. Masut
Cédric André
Dimitri Vasilevskiy
Publication date
07-11-2022
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 1/2023
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-022-10041-x

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