Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 12/2016

23-07-2016

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Authors: Jie Wu, Song-bai Xue, Jing-wen Wang, Shuang Liu, Yi-long Han, Liu-jue Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 12/2016

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC package, a major concern of Sn–Ag–Cu based solders today is continuously focused on extending service life of solder bonding formed between solders and substrates. The critical issues and improvements on Sn–Ag–Cu solders bearing alloys and nanoparticles are outlined and evaluated in this review. It can be summarized that appropriate content of certain alloys or nanoparticles addition to Sn–Ag–Cu solder is possible to tailor the solder properties, such as the melting and solidification behaviors, oxidation resistance, wettability, (interfacial) microstructure, and mechanical properties. Worthy of note is that reliability issues such as creep behavior, thermomechanical fatigue, electromigration, thermomigration and Sn whisker were briefly discussed and analyzed to lay down a solid foundation for the future development of 3D IC technology.
previous article Growth, optical and electrical properties of l-lysine-L-tartaric acid (LLLT) nonlinear optical single crystals for electro-optic applications
next article Optical properties of transparent electrodes based on carbon nanotubes and graphene platelets

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

inform now
Literature
1.
L. Zhang, K.N. Tu, Structure and properties of lead-free solders bearing micro and nano particles. Mater. Sci. Eng. R 82, 1–32 (2014)CrossRef
2.
M. Pecht, T. Shibutani, L. Wu, A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. Microelectron. Reliab. (2016). doi:10.​1016/​j.​microrel.​2016.​03.​020
3.
L.L. Gao et al., Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder. J. Mater. Sci. Mater. Electron. 21(7), 643–648 (2010)CrossRef
4.
J.W. Yoon, S.W. Kim, S.B. Jung, I.M.C. Morphology, Interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. J. Alloys Compd. 392(1), 247–252 (2005)CrossRef
5.
D.X. Luo, S.B. Xue, Z.Q. Li, Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder. J. Mater. Sci. Mater. Electron. 25(8), 3566–3571 (2014)CrossRef
6.
S. Liu, S.B. Xue, P. Xue, D.X. Luo, Present status of Sn–Zn lead-free solders bearing alloying elements. J. Mater. Sci. Mater. Electron. 26(7), 4389–4411 (2015)CrossRef
7.
A.E. Hammad, Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications. Mater. Des. 52, 663–670 (2013)CrossRef
8.
L. Sun, L. Zhang, Properties and microstructures of Sn–Ag–Cu–X lead-free solder joints in electronic packaging. Adv. Mater. Sci. Eng. 2015, 1–16 (2015)
9.
C.H. Chen et al., Interfacial reactions of low-melting Sn–Bi–Ga solder alloy on Cu substrate. J. Electron. Mater. 45, 1–6 (2016)CrossRef
10.
G. Zeng, S.B. Xue, L. Zhang, L.L. Gao, A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates. J. Mater. Sci. Mater. Electron. 21(5), 421–440 (2010)CrossRef
11.
A.T. Tan, A.W. Tan, F. Yusof, Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions. Sci. Technol. Adv. Mater. (2016). doi:10.​1088/​1468-6996/​16/​3/​033505
12.
Y. Gu et al., Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates. J. Alloys. Compd. 627, 39–47 (2015)CrossRef
13.
W.Y. Chen, C.Y. Yu, J.G. Duh, Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds. Intermetallics 54, 181–186 (2014)CrossRef
14.
N. Hamada et al., Effect of addition of small amount of zinc on microstructural evolution and thermal shock behavior in low-Ag Sn–Ag–Cu solder joints during thermal cycling. Mater. Trans. 54(5), 796–805 (2013)CrossRef
15.
J.X. Wang, H. Nishikawa, Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging. Microelectron. Reliab. 54(8), 1583–1591 (2014)CrossRef
16.
J.Y. Son et al., Study on the Characteristics of Various Dopants in Sn-1Ag-0.8Cu Solder[C]//Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th IEEE, 231–235 (2011)
17.
A. Sharma et al., Electromigration of composite Sn–Ag–Cu solder bumps. Electron. Mater. Lett. 11(6), 1072–1077 (2015)CrossRef
18.
F.Y. Ouyang, C.L. Kao, In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn–3Ag–0.5Cu flip chip solder joints. J. Appl. Phys. 110(12), 123525 (2011)CrossRef
19.
V.L. Niranjani et al., Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites. Mater. Sci. Eng. A 529, 257–264 (2011)CrossRef
20.
Q.K. Zhang et al., Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints. J. Alloys Compd. 622, 973–978 (2015)CrossRef
21.
A.E. Hammad, A.M. El-Taher, Mechanical deformation behavior of Sn–Ag–Cu solders with minor addition of 0.05 wt% Ni. J. Electron. Mater. 43(11), 4146–4157 (2014)CrossRef
22.
L. Zhang et al., Properties and microstructures of SnAgCu–xEu alloys for concentrator silicon solar cells solder layer. Sol. Energy Mater. Sol. C 130, 397–400 (2014)CrossRef
23.
24.
L.W. Lin et al., Alloying modification of Sn–Ag–Cu solders by manganese and titanium. Microelectron. Reliab. 49(3), 235–241 (2009)CrossRef
25.
L.L. Gao et al., Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder. J. Mater. Sci. Mater. Electron. 21(9), 910–916 (2010)CrossRef
26.
A.T. Wu, Y.C. Ding, The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment. Microelectron. Reliab. 49(3), 318–322 (2009)CrossRef
27.
T.H. Chuang, H.J. Lin, Inhibition of whisker growth on the surface of Sn–3Ag–0.5Cu–0.5Ce solder alloyed with Zn. J. Electron. Mater. 38(3), 420–424 (2009)CrossRef
28.
L.M. Yang, Z.F. Zhang, Effects of Y2O3 nanoparticles on growth behaviors of Cu6Sn5 grains in soldering reaction. J. Electron. Mater. 42(12), 3552–3558 (2013)CrossRef
29.
I. Shafiq, H.Y. Lau, Y.C. Chan, Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn–3.0Ag–0.5Cu solder alloy. J. Electron. Mater. 42(9), 2835–2847 (2013)CrossRef
30.
Y. Tang, Y.C. Pan, G.Y. Li, Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder. J. Mater. Sci. Mater. Electron. 24(5), 1587–1594 (2013)CrossRef
31.
A. Fawzy et al., Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5Ag–0.5Cu (SAC355) solder alloy. J. Mater. Sci. Mater. Electron. 24(9), 3210–3218 (2013)CrossRef
32.
S. Xu et al., Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing. J. Alloys Compd. 595, 92–102 (2014)CrossRef
33.
A.A. El-Daly et al., Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy. Mater. Des. 65, 1196–1204 (2015)CrossRef
34.
A. Haseeb, M.M. Arafat, M.R. Johan, Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds. Mater. Charact. 64, 27–35 (2012)CrossRef
35.
L.C. Tsao et al., Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater. Des. 31(10), 4831–4835 (2010)CrossRef
36.
S. Chellvarajoo, M.Z. Abdullah, C.Y. Khor, Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process. Mater. Des. 82, 206–215 (2015)
37.
H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: on the development of low melting temperature Pb-free solders. Microelectron. Reliab. 54(6), 1253–1273 (2014)CrossRef
38.
A.A. El-Daly et al., Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles. J. Mater. Sci. Mater. Electron. 24(8), 2976–2988 (2013)CrossRef
39.
D.X. Luo, S.B. Xue, S. Liu, Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging. J. Mater. Sci. Mater. Electron. 25(12), 5195–5200 (2014)CrossRef
40.
A.A. El-Daly, A.M. El-Taher, S. Gouda, Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Mater. Des. 65, 796–805 (2015)CrossRef
41.
C. Lejuste, F. Hodaj, L. Petit, Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate. Intermetallics 36, 102–108 (2013)CrossRef
42.
A.A. El-Daly, A.M. El-Taher, Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders. Mater. Des. 51, 789–796 (2013)CrossRef
43.
A.A. El-Daly et al., Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders. Mater. Sci. Eng. A 608, 130–138 (2014)CrossRef
44.
C.L. Chuang et al., Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder. Mater. Sci. Eng. A 558, 478–484 (2012)CrossRef
45.
D.A.A. Shnawah et al., Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications. Mater. Sci. Eng. A 551, 160–168 (2012)CrossRef
46.
L.L. Gao et al., Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectron. Eng. 87(11), 2025–2034 (2010)CrossRef
47.
M.A. Dudek, N. Chawla, Effect of rare-earth (La, Ce, and Y) additions on the microstructure and mechanical behavior of Sn–3.9Ag–0.7Cu solder alloy. Metall. Mater. Trans. A 41(3), 610–620 (2010)CrossRef
48.
X.D. Liu et al., Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder. Mater. Sci. Eng. A 562, 25–32 (2013)CrossRef
49.
Y.D. Han et al., Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 22(3), 315–322 (2011)CrossRef
50.
S. Chantaramanee et al., Development of a lead-free composite solder from Sn–Ag–Cu and Ag-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 24(10), 707–3715 (2013)CrossRef
51.
A.A. El-Daly et al., Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance. Mater. Sci. Eng. A 578, 62–71 (2013)CrossRef
52.
K.C. Yung et al., Size control and characterization of Sn–Ag–Cu lead-free nanosolders by a chemical reduction process. J. Electron. Mater. 41(2), 313–321 (2012)CrossRef
53.
F.E. Atalay et al., Nanowires of lead-free solder alloy SnCuAg. J. Nanomater. 2011, 37 (2011)CrossRef
54.
A. Novikov, G. Holzhüter, M. Nowottnick. Low-Temperature Assembling Process with Nanoscaled Solder Layers[C]//Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on IEEE, 1–4 (2012)
55.
Y. Shu et al., Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux. J. Alloys Compd. 626, 391–400 (2015)CrossRef
56.
A.A. El-Daly et al., Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions. Mater. Des. 43, 40–49 (2013)CrossRef
57.
A.A. El-Daly, A.E. Hammad, Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions. Mater. Des. 40, 292–298 (2012)CrossRef
58.
A.A. El-Daly, A.M. El-Taher, T.R. Dalloul, Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. J. Alloys Compd. 587, 32–39 (2014)CrossRef
59.
M. Amagai, A study of nanoparticles in Sn–Ag based lead free solders. Microelectron. Reliab. 48(1), 1–16 (2008)CrossRef
60.
L. Zhang et al., Properties enhancement of SnAgCu solders containing rare earth Yb. Mater. Des. 57, 646–651 (2014)CrossRef
61.
Z. Deng, Y. Qian, Effect of P on the oxidation resistance of Sn–0.7Cu lead-free solder. Electron. Process. Technol. 4, 000 (2006)
62.
X.J. Wang et al., Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder. J. Mater. Sci. Mater. Electron. 25(5), 2297–2304 (2014)CrossRef
63.
W.X. Dong et al., Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. J. Mater. Sci. Mater. Electron. 20(10), 1008–1017 (2009)CrossRef
64.
J. J. Wang et al., Study on low silver Sn–Ag–Cu–P alloy for wave soldering physical and failure analysis of integrated circuits (IPFA), 2013 20th IEEE International Symposium on the IEEE, 485–489 (2013)
65.
L. Hua et al., Effects of Zn, Ge Doping on Electrochemical Migration, Oxidation Characteristics and Corrosion Behavior of Lead-Free Sn–3.0Ag–0.5Cu Solder for Electronic Packaging[C]//Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on IEEE, 1151–1157 (2010)
66.
A.J. Jeon et al., Effect of indium content on the melting point, dross, and oxidation characteristics of Sn–2Ag–3Bi–xIn Solders. J. Electron. Packag. 135(2), 021006 (2013)CrossRef
67.
M.A. Dudek, N. Chawla, Oxidation behavior of rare-earth-containing Pb-free solders. J. Electron. Mater. 38(2), 210–220 (2009)CrossRef
68.
69.
M.E. Loomans et al., Investigation of multi-component lead-free solders. J. Electron. Mater. 23(8), 741–746 (1994)CrossRef
70.
W.F. Feng, C.Q. Wang, M. Morinaga, Electronic structure mechanism for the wettability of Sn-based solder alloys. J. Electron. Mater. 31(3), 185–190 (2002)CrossRef
71.
G. Zeng et al., Recent advances on Sn–Cu solders with alloying elements: review. J. Mater. Sci. Mater. Electron. 22(6), 565–578 (2011)CrossRef
72.
W.X. Chen et al., Effects of rare earth Ce on properties of Sn–9Zn lead-free solder. J. Mater. Sci. Mater. Electron. 21(7), 719–725 (2010)CrossRef
73.
H.W. Zhang, F.L. Sun, Y. Liu, Effects of Adding Some Elements on Solderability of Sn–0.7 Ag–0.5 Cu Solder[C]//Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on IEEE, 254–257 (2010)
74.
S. Lu et al., The effects of Bi on physical and microstructural characteristics of Sn–Ag–Cu lead-free solders[C]//physical and failure analysis of integrated circuits, 2009. IPFA 2009. 16th IEEE international symposium on the IEEE, 782–784 (2009)
75.
Y. Li et al., Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu–xTiO2 nano-composite solders. J. Mater. Sci. Mater. Electron. 25(9), 3816–3827 (2014)CrossRef
76.
L. Bernstein, Semiconductor joining by the solid–liquid-interdiffusion (SLID) process I. The systems Ag–In, Au–In, and Cu–In. J. Electrochem. Soc. 113(12), 1282–1288 (1966)CrossRef
77.
L. Yang et al., Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder. J. Mater. Sci. Mater. Electron. 26(1), 613–619 (2015)CrossRef
78.
M.J. Rizvi et al., Wetting and reaction of Sn–2.8Ag–0.5Cu–1.0Bi solder with Cu and Ni substrates. J. Electron. Mater. 34(8), 1115–1122 (2005)CrossRef
79.
X.J. Liu et al., Thermodynamic calculation of phase equilibria in the Sn–Ag–Cu–Ni–Au system. J. Electron. Mater. 36(11), 1429–1441 (2007)CrossRef
80.
K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints. J. Alloys Compd. 352(1), 226–236 (2003)CrossRef
81.
S.K. Kang et al., Ag3Sn plate formation in the solidification of near-ternary eutectic Sn–Ag–Cu. JOM 55(6), 61–65 (2003)CrossRef
82.
L. Yang, Z.F. Zhang, Growth behavior of intermetallic compounds in Cu/Sn3.0Ag0.5Cu solder joints with different rates of cooling. J. Electron. Mater. 44(1), 590–596 (2015)CrossRef
83.
N.Y. Chen, Bond-parametric function and its applications (Science Press, Peking, 1976), p. 15
84.
D.A. Shnawah et al., Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys. J. Alloys Compd. 622, 184–188 (2015)CrossRef
85.
L.S. Darken, R.W. Gurry, Physical chemistry of metals[M] (McGraw-Hill, New York, 1953)
86.
X. Chen et al., Microstructures and mechanical properties of Sn–0.1Ag–0.7Cu–(Co, Ni, and Nd) lead-free solders. J. Electron. Mater. 44(2), 725–732 (2015)CrossRef
87.
A.A. El-Daly, A.M. El-Taher, S. Gouda, Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly. J. Alloys Compd. 627, 268–275 (2015)CrossRef
88.
A.A. El-Daly et al., Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying. J. Alloys Compd. 653, 402–410 (2015)CrossRef
89.
S.Y. Xu et al., Effects of FeCo magnetic nanoparticles on microstructure of Sn–Ag–Cu alloys. J. Appl. Phys. 113(17), 17A301 (2013)
90.
K.N. Tu, Irreversible processes of spontaneous whisker growth in bimetallic Cu–Sn thin-film reactions. Phys. Rev. B 49(3), 2030 (1994)CrossRef
91.
K.N. Tu, R.D. Thompson, Kinetics of interfacial reaction in bimetallic Cu–Sn thin films. Acta Metall. 30(5), 947–952 (1982)CrossRef
92.
L. Zhang et al., Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)CrossRef
93.
S.Y. Chang et al., The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu–0.5Al2O3 composite solder/Cu interface during soldering reaction. J. Mater. Sci. Mater. Electron. 23(1), 100–107 (2012)CrossRef
94.
T. Fouzder et al., Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. J. Alloys Compd. 509(5), 1885–1892 (2011)CrossRef
95.
J.F. Li, P.A. Agyakwa, C.M. Johnson, Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate. J. Alloys Compd. 545, 70–79 (2012)CrossRef
96.
C.E. Ho et al., Influence of Pd concentration on the interfacial reaction and mechanical reliability of the Ni/Sn–Ag–Cu–xPd System. J. Electron. Mater. 41(1), 2–10 (2012)CrossRef
97.
G.Y. Li et al., Influence of dopant on growth of intermetallic layers in Sn–Ag–Cu solder joints. J. Electron. Mater. 40(2), 165–175 (2011)CrossRef
98.
A.A. El-Daly, A.M. El-Taher, Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters. Mater. Des. 47(9), 607–614 (2013)CrossRef
99.
A.K. Gain et al., Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages. Microelectron. Eng. 86(11), 2347–2353 (2009)CrossRef
100.
J. Keller et al., Mechanical properties of Pb-free SnAg solder joints. Acta Mater. 59(7), 2731–2741 (2011)CrossRef
101.
L.M. Yang, Z.F. Zhang, Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint. J. Appl. Phys. 117(1), 015308 (2015)CrossRef
102.
A.K. Gain, Y.C. Chan, W.K.C. Yung, Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51(12), 2306–2313 (2011)CrossRef
103.
L.C. Tsao et al., Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads. Mater. Des. 50, 774–781 (2013)CrossRef
104.
Y. Liu, F.L. Sun, X.M. Li, Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints. J. Mater. Sci. Mater. Electron. 25(6), 2627–2633 (2014)CrossRef
105.
D.A.A. Shnawah et al., The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt%). J. Mater. Sci. Mater. Electron. 23(11), 1988–1997 (2012)CrossRef
106.
A.E. Hammad, Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni. Mater. Des. 50(17), 108–116 (2013)CrossRef
107.
A.A. El-Daly et al., Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn. J. Alloys Compd. 614, 20–28 (2014)CrossRef
108.
V.L. Niranjani et al., Creep behaviour of SAC387 lead free solder alloy reinforced with single walled carbon nanotubes. Trans. Indian Met. 68(2), 311–317 (2015)CrossRef
109.
A.A. El-Daly et al., Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder. Mater. Sci. Eng. A 618, 389–397 (2014)CrossRef
110.
A.A. El-Daly, A.M. El-Taher, T.R. Dalloul, Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders. Mater. Des. 55, 309–318 (2014)CrossRef
111.
Y. Lee, C. Basaran, A creep model for solder alloys. J. Electron. Packag. 133(4), 044501 (2011)CrossRef
112.
D. Witkin, Creep behavior of Bi-containing lead-free solder alloys. J. Electron. Mater. 41(2), 190–203 (2012)CrossRef
113.
Y.D. Han et al., Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 23(5), 1108–1115 (2011)CrossRef
114.
Z.B. Yang, W. Zhou, P. Wu, Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys. Mater. Sci. Eng. A 590, 295–300 (2014)CrossRef
115.
F.X. Che, X. Zhang, J.K. Lin, Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. (2016). doi:10.​1016/​j.​microrel.​2015.​12.​041
116.
C.S. Lau et al., Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review. Solder. Surf. Mt. Technol. 28(2), 41–62 (2016)CrossRef
117.
Q. Zhou et al., Microstructural evolution of SAC305 solder joints in wafer level chip-scale packaging (WLCSP) with continuous and interrupted accelerated thermal cycling. J. Electron. Mater. 45(6), 1–12 (2016)
118.
L. Zhang et al., Microstructures and fatigue life of SnAgCu solder joints bearing nano-Al particles in QFP devices. Electron. Mater. Lett. 10(3), 645–647 (2014)CrossRef
119.
M.A. Matin, W.P. Vellinga, M.G.D. Geers, Thermomechanical fatigue damage evolution in SAC solder joints. Mater. Sci. Eng. A 445, 73–85 (2007)CrossRef
120.
F.X. Che, J.H.L. Pang, Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints. J. Alloys Compd. 541, 6–13 (2012)CrossRef
121.
S. Mukherjee, T.T. Mattila, A. Dasgupta, Effect of Addition of Manganese and Antimony on Viscoplastic Properties and Cyclic Mechanical Durability of Low Silver Sn–Ag–Cu solder[C]//Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on IEEE, 888–895 (2012)
122.
Y.D. Han et al., Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling. Intermetallics 31, 72–78 (2012)CrossRef
123.
D.A. Shnawah, M.F.M. Sabri, I.A. Badruddin, A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron. Reliab. 52(1), 90–99 (2012)CrossRef
124.
A.M. Yu et al., Pd-doped Sn–Ag–Cu–In solder material for high drop/shock reliability. Mater. Res. Bull. 45(3), 359–361 (2010)CrossRef
125.
K. Lee, K.S. Kim, K. Suganuma, Influence of indium addition on electromigration behavior of solder joint. J. Mater. Res. 26(20), 2624–2631 (2011)CrossRef
126.
Q.T. Huynh et al., Electromigration in eutectic Sn–Pb solder lines. J. Appl. Phys. 89(8), 4332–4335 (2001)CrossRef
127.
X. Zhu et al., Electromigration in Sn–Ag solder thin films under high current density. Thin Solid Films 565(9), 193–201 (2014)CrossRef
128.
F. Su et al., Study of electromigration-induced stress of solder. J. Electron. Packag. 137(2), 021006 (2015)CrossRef
129.
C. Chen, H.M. Tong, K.N. Tu, Electromigration and thermomigration in Pb-free flip-chip solder joints. Annu. Rev. Mater. Res. 40, 531–555 (2010)CrossRef
130.
W. Yao, C. Basaran, Computational damage mechanics of electromigration and thermomigration. J. Appl. Phys. 114(10), 103708 (2013)CrossRef
131.
K.N. Tu, H.Y. Hsiao, C. Chen, Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy. Microelectron. Reliab. 53(1), 2–6 (2013)CrossRef
132.
Y. Tao et al., Theoretical Analysis on the Element Diffusion During Thermomigration[C]//Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on IEEE, 1–5 (2011)
133.
H.B. Huntington, A.R. Grone, Current-induced marker motion in gold wires. J. Phys. Chem. Solids 20(1), 76–87 (1961)CrossRef
134.
H.X. Xie et al., Electromigration damage characterization in Sn–3.9Ag–0.7Cu and Sn–3.9Ag–0.7Cu–0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy. J. Electron. Mater. 43(1), 33–42 (2014)CrossRef
135.
K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38(2), 55–105 (2002)CrossRef
136.
Z. Yang, W. Zhou, P. Wu, Effects of Ni-coated carbon nanotubes addition on the electromigration of Sn–Ag–Cu solder joints. J. Alloys Compd. 581, 202–205 (2013)CrossRef
137.
Z.H.A.O. Ni et al., Research progress in thermomigration of metal atoms in micro solder joints and its effect on interfacial reaction. Chin. J. Nonferr. Met. 25(8), 2157–2166 (2015)
138.
S.H. Lee, C.M. Chen, Electromigration in a Sn–3 wt% Ag–0.5 wt% Cu–3 wt% Bi solder stripe between two Cu electrodes under current stressing. J. Electron. Mater. 40(9), 1943–1949 (2011)CrossRef
139.
L. Ma et al., Effects of Co additions on electromigration behaviors in Sn–3.0Ag–0.5Cu-based solder joint. J. Mater. Sci. 46(14), 4896–4905 (2011)CrossRef
140.
F.L. Sun, Y. Liu, J.B. Wang, Improving the Solderability and Electromigration Behavior of Low-Ag SnAgCu Soldering[C]//Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on IEEE, 1/5–5/5 (2011)
141.
X. Zhao et al., The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder. Microsyst. Technol. 18(12), 2077–2084 (2012)CrossRef
142.
H.Y. Liu et al., Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect. J. Mater. Sci. Mater. Electron. 24(1), 211–216 (2013)CrossRef
143.
P. He et al., Effect of 0.8 wt% Al 2 O 3 Nanoparticles Addition on the Microstructures and Electromigration Behavior of Sn–Ag–Cu Solder Joint[C]//Electronic Packaging Technology (ICEPT), 2015 16th International Conference on IEEE, 1014–1017 (2015)
144.
T.H. Chuang, Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints. Scr. Mater. 55(11), 983–986 (2006)CrossRef
145.
H.J. Lin, T.H. Chuang, Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn–3Ag–0.5Cu solder joints. J. Alloys Compd. 500(2), 167–174 (2010)CrossRef
146.
P. Xue et al., Inhibiting the growth of Sn whisker in Sn–9Zn lead-free solder by Nd and Ga. J. Mater. Sci. Mater. Electron. 25(6), 2671–2675 (2014)CrossRef
147.
T.H. Chuang, C.C. Jain, Morphology of the Tin whiskers on the surface of a Sn–3Ag–0.5Cu–0.5Nd Alloy. Metall. Mater. Trans. A 42(3), 684–691 (2010)CrossRef
148.
M.A. Dudek, N. Chawla, Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders. Acta Mater. 57(15), 4588–4599 (2009)CrossRef
149.
T.H. Chuang, S.F. Yen, Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package. J. Electron. Mater. 35(8), 1621–1627 (2006)CrossRef
150.
L. Hua, C. Yang, Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5 Cu solder doping with In and Zn in NaCl solution. Microelectron. Reliab. 51(12), 2274–2283 (2011)CrossRef
151.
A. Sharma et al., Influence of current density on microstructure of pulse electrodeposited tin coatings. Mater. Charact. 68, 22–32 (2012)CrossRef
152.
A. Baated et al., Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders. J. Mater. Sci. Mater. Electron. 21(10), 1066–1075 (2010)CrossRef
Metadata
Title
Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging
Authors
Jie Wu
Song-bai Xue
Jing-wen Wang
Shuang Liu
Yi-long Han
Liu-jue Wang
Publication date
23-07-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 12/2016
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-5407-3

Other articles of this Issue 12/2016

Journal of Materials Science: Materials in Electronics 12/2016 Go to the issue

OriginalPaper

Improved photocatalytic properties and anti-bacterial activity of size reduced ZnO nanoparticles via PEG-assisted precipitation route

OriginalPaper

Chemical and electrochemical grafting of polythiophene onto poly(methyl methacrylate), and its electrospun nanofibers with gelatin

OriginalPaper

Change of mechanical performance and characterization with replacement of Ca by Gd nanoparticles in Bi-2212 system and suppression of durable tetragonal phase by Gd

OriginalPaper

Effect of zero bias Gamma ray irradiation on HfO2 thin films

OriginalPaper

Synthesis and characterization of mercaptoacetic acid/lead sulfide inorganic/organic nanocomposite

OriginalPaper

Thermoelectric properties of directionally grown Bi2Ba2Co2Oδ/Ag composites: effect of annealing