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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 5/2010

01.05.2010 | Review

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

verfasst von: Guang Zeng, Songbai Xue, Liang Zhang, Lili Gao, Wei Dai, Jiadong Luo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 5/2010

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Abstract

The objective of this review is to study the interfacial intermatallic compounds (IMCs) between Sn–Ag–Cu based solders and common substrates, which play a crucial role in solder joints typically present in Pb-free electronics manufacturing. The microstructural evolution of IMCs at the solder/substrate interfaces is analyzed, while the models and theories describing the formation/growth mechanism of interfacial IMCs are also introduced. We focus on the influence of a variety of factors that have been reported recently, including substrates, minor alloying, mechanical stress, electromigration and thermomigration etc., as full understanding of the mechanisms that determine the formation and growth of interfacial IMCs is important to reach for developing high reliability solder joints. In the end of this review, the characteristics of the IMCs are compared and illustrated, which have marked effect on the mechanical properties and fracture behavior as well as reliability of solder joints.
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Metadaten
Titel
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
verfasst von
Guang Zeng
Songbai Xue
Liang Zhang
Lili Gao
Wei Dai
Jiadong Luo
Publikationsdatum
01.05.2010
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 5/2010
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-010-0086-y

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