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Journal of Materials Science: Materials in Electronics

Ausgabe 5/2010

Inhalt (18 Artikel)

Review

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Guang Zeng, Songbai Xue, Liang Zhang, Lili Gao, Wei Dai, Jiadong Luo

The effect of post-annealing under CdCl2 atmosphere on the properties of ITO thin films deposited by DC magnetron sputtering

Shenghao Wang, Jingquan Zhang, Bo Wang, Lianghuan Feng, Yaping Cai, Lili Wu, Wei Li, Zhi Lei, Bing Li

InAs quantum dot superluminescent diodes with trench structure

Young Chae Yoo, Lee-Hyun Kim, Il Ki Han

Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy

E. Çadırlı, U. Böyük, S. Engin, H. Kaya, N. Maraşlı, M. Arı

Analysis of weakly bonded oxygen in HfO2/SiO2/Si stacks by using HRBS and ARXPS

Ta-Chang Tien, Li-Chuan Lin, Lurng-Shehng Lee, Chi-Jen Hwang, Siddheswar Maikap, Yuri M. Shulga

Effect of oxygen to argon ratio on the properties of thin SiO x films deposited by r.f. sputtering

J. M. Terrazas, N. Nedev, E. Manolov, B. Valdez, D. Nesheva, M. A. Curiel, R. Haasch, I. Petrov

Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes

Dapeng Chen, Xueliang Qiao, Xiaolin Qiu, Fatang Tan, Jianguo Chen, Renzhi Jiang

Investigation on properties of Ga to Sn–9Zn lead-free solder

Wenxue Chen, Songbai Xue, Hui Wang, Jianxin Wang, Zongjie Han

Optical and electrical properties of Mg x Zn1−x O thin films by sol–gel method

Jia Li, Jin-Hua Huang, Wei-Jie Song, Rui-Qin Tan, Ye Yang, Xiao-Min Li

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