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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1/2015

01.01.2015

Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder

verfasst von: Li Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai, Yanfeng Jing

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2015

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Abstract

Minor weight fraction of the BaTiO3 particle is doped into the Sn1.0Ag0.5Cu (SAC) lead-free solder by the mechanically mixing. The effect of BaTiO3 on the microstructure and mechanical properties of the SAC lead-free solder is investigated. The results show that the β-Sn is refined and the volume fraction of the eutectic phase is increased by adding BaTiO3. The β-Sn morphology is transformed from the block into the lamellar in the SAC + 0.2 wt% BaTiO3, and a Cu6Sn5 IMC layer with thickness of about 7.3 μm is obtained. The optimal spreadability of the SAC–0.2BaTiO3 is obtained, and the spreading coefficient reaches 0.7836, it is 23.48 % higher than that of the SAC solder. The ultimate tensile strength and the elongation are improved by the BaTiO3 addition. The fracture surface of the SAC–0.2BaTiO3 solder specimen consists of large amounts of dimples due to the highly ductile manner.
Vorheriger Artikel The improvement research on microwave dielectric properties of magnesium tungstate for LTCC

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Metadaten
Titel
Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder
verfasst von
Li Yang
Jinguo Ge
Yaocheng Zhang
Jun Dai
Yanfeng Jing
Publikationsdatum
01.01.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2443-8

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