A Novel Repair and Maintenance Mechanism for ‘Integrated Circuits’ of Ubiquitous IoT Devices by Performing Virtual IC Inspection Based on ‘Light Field Technology’

The proposed research discloses a novel mechanism for repairing and maintaining the electronic circuits during an event of failure without actually dismantling or opening-up the device circuit boards. The mechanism uses light field technology, wherein a 3D interactive view of the short circuit component is projected so that the technician can directly interact with the 3D display and in turn fix the wiring in the actual device circuit without physically interacting with the circuit. As the technician interacts with the 3D display, the light source within the internal circuitry generates multiple light beams that fluctuate with varying intensities and apply an optical force on the damaged circuit components so that the circuit components align and re-arrange themselves. We have used Spatial Light Modulator (SLM) for this purpose since the SLM optimizes and focuses light on the target (damaged) circuit component and can drive the component mechanically with greater magnitude. The optimization of SLM is carried out by using the Genetic Algorithm (GA). The simulation results for the optimized SLM based on GA are presented in the research proposal.