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2020 | OriginalPaper | Buchkapitel

Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

verfasst von : Daudi R. Waryoba, Linsea Paradis

Erschienen in: TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings

Verlag: Springer International Publishing

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Abstract

Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.

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Titel: Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts
verfasst von: Daudi R. Waryoba
Linsea Paradis
Verlag: Springer International Publishing
Buch: TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings
Print ISBN: 978-3-030-36295-9

Electronic ISBN: 978-3-030-36296-6

Copyright-Jahr: 2020
DOI: https://doi.org/10.1007/978-3-030-36296-6_189

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