Effect of chemical structure of aromatic dianhydrides on the thermal, mechanical and electrical properties of their terpolyimides with 4,4′-oxydianiline

Aromatic terpolyimides were synthesized by the reaction of 3,3′,4,4′-oxydiphthalicdianhydride(ODPA), 3,3′,4,4′-biphenyldianhydride(BPDA) and 3,3′,4,4′-benzophenonetetracaboxylicdianhydride(BTDA) with 4,4′-oxydianiline(ODA) via thermal imidization with the view to enhance their tensile properties without compromising thermal properties compared to their homo and copolyimides. Their films were characterized by FTIR, TGA, DSC and XRD. Their FTIR spectra established formation of polyimide by the characteristic vibrations at 1375cm⁻¹(C-N stretch) and 1113 cm⁻¹(imide ring deformation). TGA results showed imidization of residual polyamide acid close to 250 °C and decomposition of polyimides at about 540 °C. XRD results showed amorphous nature for all terpolyimides. Their tensile strength and tensile modulus were higher than either homo or copolyimides. Incorporation of BPDA, without bridging groups between the aromatic rings into the backbone of ODPA/BTDA-ODA is suggested as the cause for such an enhancement. Such terpolyimide can find application as adhesives in making flexible single/multilayer polyimide metal-clad laminates in flexible printed circuits and tape automated bonding applications. In addition, the terpolyimide, BPDA/BTDA/ODPA-ODA (mole ratio 0.5:0.25:0.25:1), showed low dielectric constant (3.52) as BPDA could offer slight rigidity by which the orientation of polar groupings could be reduced.