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2018 | OriginalPaper | Buchkapitel

Efficient Integration of Zoom ADC with Temperature Sensors for System on Chip Applications—A Perspective

verfasst von : Rafath Unnisa, P. Trinatha Rao

Erschienen in: Microelectronics, Electromagnetics and Telecommunications

Verlag: Springer Singapore

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Abstract

For different types of measurements, various sensors are readily available in the market. These sensors have their output signal which is less than the optimal. Low-cost versions of the sensors introduce quite a large gain and offset variation in a temperature sensor. Addition of amplification ICs and minimum change in amplification settings before integrating sensing element to ADC helps in overcoming such situations. As an alternative, more sensitive and better-controlled sensors can be considered but at an extra cost. Another way to overcome the gain and offset variation is to use Zoom ADC which has the advantages of oversampled ADCs with extra amplification stage for measuring sensing elements with higher resolution. Efficient integration of Zoom ADC with temperature sensor in System on Chip helps in improving performance of the SoC. By the usage of an advanced algorithm for the development of zoom ADC has been implemented in this research, which further improves the performance and efficiency of System on Chip.

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Literatur
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Zurück zum Zitat Fabio Sebastiano, Kofi A.A. Makinwa, D.: A 1.2-V 10-µW NPN-Based Temperature Sensor in 65-nm CMOS With an Inaccuracy of 0.2 C (3σ) From 70 ͦC to 125 ͦC, IEEE Journal of Solid-State Circuits, Vol. 45, No. 12, (Oct. 2010) 2591–2601. Fabio Sebastiano, Kofi A.A. Makinwa, D.: A 1.2-V 10-µW NPN-Based Temperature Sensor in 65-nm CMOS With an Inaccuracy of 0.2 C (3σ) From 70 ͦC to 125 ͦC, IEEE Journal of Solid-State Circuits, Vol. 45, No. 12, (Oct. 2010) 2591–2601.
Metadaten
Titel
Efficient Integration of Zoom ADC with Temperature Sensors for System on Chip Applications—A Perspective
verfasst von
Rafath Unnisa
P. Trinatha Rao
Copyright-Jahr
2018
Verlag
Springer Singapore
DOI
https://doi.org/10.1007/978-981-10-7329-8_32

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