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Über dieses Buch

The application of BEM in all fields of engineering and science has progressed at an accelerate rate since the first book on the method appeared in the late seventies. In particular the advantages of BEM for potential problems are essential to solve a whole range of electrical engineering problems. Previous volumes in this series have focussed on the state of the art in other fields while this volume discusses only problems related to electrical engineering. The book reviews a series of important applications such as the design of semiconductor devices and their thermal analysis. The following two chapters concentrate on the study of galvanic corrosion and cathodic protection. Chapter 4 deals with the design of capacitance transducers. The next three chapters concentrate on the applications of the method to simulate electrochemical problems with special reference to Plating Process. The last chapter in the book discusses the case of inverse problems in electrical engineering and presents some applications including their use in tomography.



Chapter 1. Semiconductor Device Analysis

A review concerning the basic semiconductor equations and the most used approximations is given in relation to the research activities with the boundary element method.
G. De Mey

Chapter 2. Thermal Analysis of Semiconductor Devices

To produce a device, three major aspects of the device operation and fabrication must be studied. The first aspect is the transport of charge carriers, namely, electrons and holes, inside the device. The second one is the process by which the devices are fabricated, and the third is the dissipation of heat from the devices to its environment. The study of carrier transport is commonly referred to as device physics, device modeling or device simulation. Over the past four decades, analytical techniques have been utilized to study devices with simple geometries [1–3]. Later, when the device structures became more complicated, two-dimensional numerical analyses based upon the finite difference method [4–6] have been used. Meanwhile, the three-dimensional finite element technique has also been developed to solve the nonlinear transport equations numerically for devices operating under steady state and transient conditions [7].
C. C. Lee, A. L. Palisoc

Chapter 3. Applications of Boundary Elements in Corrosion Engineering

In recent years there has been a growing interest in the prediction of the behaviour of engineering problems involving galvanic effects. This class of problem includes galvanic corrosion, cathodic protection methods and the inverse problem of electrodeposition commonly used in manufacturing. This article will concern how a computer software system based on boundary elements can be used to accurately simulate this class of problem.
R. A. Adey, C. A. Brebbia, S. M. Niku

Chapter 4. Application of BEM to Galvanic Corrosion and Cathodic Protection

When two different metals are electrically connected in a corrosive environment, the least noble of the two corrodes more rapidly than when unconnected. This phenomenon, which is called galvanic corrosion, is often observed in many applications, because the contact of dissimilar metals is unavoidable for various reasons. The economic loss due to galvanic corrosion in structures, such as underground pipelines, off-shore structures and chemical plants, is estimated to be tremendously great. In order to reduce the loss, it would be necessary to design such structures and protection systems based on a precise analysis of the corrosion behaviors. Many attempts have been made to analyze galvanic corrosion and protection problems.
S. Aoki, K. Kishimoto

Chapter 5. Capacitance of Transducers for Displacement Measurement

The calculation or measurement of capacitances is a basic problem to determine the form or performance of electrical, electronic devices and components such as VLSI [1–6], capacitive transducer [7–10] for an automatic and precise measurement of displacement, and lead cable [11]. Computer simulations have been applied to obtaining the performance or optimum form of VLSI [5, 6], of capacitive transducer [8–10], and of lead cable [11]. It is the most efficient and economical to become able to obtain the optimum form or performance of electrical, electronic devises and components only by a computer simulation without any actual experiment, but it becomes more efficient and economical only if the labours and costs of actual measurements are largely reduced by means of computer simulation.
M. Hirasawa, M. Nakamura

Chapter 6. Electroplating

The field of Computer Aided Design (CAD) has found numerous applications in the electroplating industry during the past few years. One of these applications is the prediction of the plated profile as a function of time. In electroplating, two metals are separated by an electrolyte. The metal to be plated is called the cathode whereas the metal providing the material is named the anode. The quality of the overall plating process is directly related to the profile change of cathode.
N. G. Zamani, J. M. Chuang

Chapter 7. Simulation of an Electrochemical Plating Process

The application of the boundary element method for modeling electrochemical plating processes is described. The part geometry produced by a plating experiment utilizing a realistic cathode shape is compared with the computer simulation predictions.
J. S. Bullock, G. Giles, L. J. Gray

Chapter 8. Electrochemical Cell Design

In industrial electrochemistry there is an increasing demand for high speed and high efficiency processes. In order to perform these objectives one needs a perfect insight in the interaction between electrode kinetics, cell geometry and mass- and charge transport. For many practical problems it is possible to simplify the general equations to a potential problem describing only transport of charge or only transport of mass in the electrolytic solution. That potential problem has non-linear boundary conditions due to the electrochemical reactions on the electrodes.
J. Deconinck

Chapter 9. Inverse Problems and Some Applications

Recently Inverse Problems have received a great deal of attention in many branches of engineering. The term ‘inverse’ however means different things to different people [1–4]. In a sense, all design problems are inverse problems as in general specifications are first given which ought then to be satisfied by the designer. There are many possible solutions which satisfy a given set of specifications and one usually designs by a process of trial and error based on experience until all specifications are satisfied.
Y. Kagawa


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