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Erschienen in:
2023 | OriginalPaper | Buchkapitel
Estimation of Wire Surface Quality Index During Wire Electric Discharge Machining Using Image Processing Technique
verfasst von : Sanghamitra Das, Shrikrishna Nandkishor Joshi
Erschienen in: Low Cost Manufacturing Technologies
Verlag: Springer Nature Singapore
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Abstract
Wire wear and breakage during wire electric discharge machining (WEDM) is a major drawback in modern industries. In an effort to prevent wire failure during WEDM, a surface quality index (SQI) of eroded wires is determined in order to quantify and minimize the severity of wire surface damages. Zinc-coated brass wire was used for WEDM experiments on Ti–6Al–4V alloy. Field emission scanning electron microscope (FESEM) and energy-dispersive X-ray spectroscopy system (EDX) were used to analyse the surface damages on the machined wire samples. From FESEM wire pictures, a wire SQI was calculated by employing an image processing (IP) technique to plot an image histogram. A histogram was drawn using ImageJ software to observe the change in pixel intensity across the image. Using the mean value of the image histogram of degraded wire samples, it was possible to figure out the limit for wire wear beyond which the wire is highly susceptible to breaking.