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Erschienen in:
Concept-Oriented Modeling of Dynamic Behavior Kapitel lesen Erstes Kapitel lesen

2011 | OriginalPaper | Buchkapitel

4. Incremental Bond Graphs

verfasst von : Wolfgang Borutzky

Erschienen in: Bond Graph Modelling of Engineering Systems

Verlag: Springer New York

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Abstract

Incremental true bond graphs are used for a matrix-based determination of first-order parameter sensitivities of transfer functions, of residuals of analytical redundancy relations, and of the transfer matrix of the inverse model of a linear multiple-input–multiple-output system given that the latter exists. Existing software can be used for this approach for the derivation of equations from a bond graph and from its associated incremental bond graph and for building the necessary matrices in symbolic form. Parameter sensitivities of transfer functions are obtained by multiplication of matrix entries. Symbolic differentiation of transfer functions is not needed. The approach is illustrated by means of hand derivation of results for small well-known examples.

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Vorheriges Kapitel LFT Bond Graph Model-Based Robust Fault Detection and Isolation
Nächstes Kapitel Coaxially Coupled Inverted Pendula: Bond Graph-Based Modelling, Design and Control
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20-sim® is a registered trademark of Controllab Products B.V., Hengelosestraat 705, 7521 PA Enschede, The Netherlands, http://​www.​20sim.​com
 
2
SYMBOLS Shakti™ is a trademark of High Tech Consultants, STEP, I.I.T. Kharagpur – 721 302, India, http://​www.​htcinfo.​com
 
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Mathematica® is a trademark of Wolfram Research, Inc., 100 Trade Center Drive, Champaign, IL 61820-7237, USA, http://​www.​wolfram.​com
 
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Maple™ is a trademark of Waterloo Maple Inc., 615 Kumpf Drive, Waterloo, ON, Canada N2V1K8, http://​www.​maplesoft.​com
 
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MATLAB®, Simulink®, and Symbolic Math Toolbox™ are trademarks of The Mathworks, Inc., 3 Apple Hill Drive, Natick, MA 01760-2098, USA, http://​www.​mathworks.​com
 
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Metadaten
Titel
Incremental Bond Graphs
verfasst von
Wolfgang Borutzky
Copyright-Jahr
2011
Verlag
Springer New York
Buch
Bond Graph Modelling of Engineering Systems

Print ISBN: 978-1-4419-9367-0

Electronic ISBN: 978-1-4419-9368-7

Copyright-Jahr: 2011

DOI
https://doi.org/10.1007/978-1-4419-9368-7_4

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