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01.11.2015 | Original Paper

Investigation of structural and electrical properties of novel CuO–PVA nanocomposite films

verfasst von: Jammula Koteswara Rao, Abhishek Raizada, Debargha Ganguly, Madri Manish Mankad, S. V. Satayanarayana, G. M. Madhu

Erschienen in: Journal of Materials Science | Ausgabe 21/2015

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Abstract

The objective of this study was to investigate the effects of CuO nanoparticles on the structural, thermal and electrical properties of polyvinyl alcohol (PVA) thin films. The thin films were prepared by a solution casting technique with different weight percentages viz., 0.5, 1.0, 1.5 and 2.0 wt% of CuO nanoparticles in PVA matrix. The fabricated nanocomposite thin films were structurally characterised by Fourier transform infrared spectroscopy and X-ray diffraction, while differential scanning calorimetry indicated the effect of CuO nanoparticles on thermal properties of PVA. The surface morphology of the films was determined by scanning electron microscopy technique. Dielectric properties were analysed using high frequency LCR metre and were found to be dependent on frequency and CuO concentration. Dielectric constant decreased with increase in both frequency and CuO concentration. Dielectric loss increased with frequency increase and decreased with increase in CuO concentration. AC conductivity increased with increase in frequency. PVA-2.0 wt% CuO nanocomposite was found to possess desirable properties such as low dielectric constant and low dielectric loss which makes it a desirable material for use in microelectronics industry.

Vorheriger Artikel Micropillar compression testing of powders

Nächster Artikel Diffraction-line shifts and broadenings in continuously and discontinuously coarsening precipitate-matrix systems: coarsening of initially coherent nitride precipitates in a ferrite matrix

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Titel: Investigation of structural and electrical properties of novel CuO–PVA nanocomposite films
verfasst von: Jammula Koteswara Rao
Abhishek Raizada
Debargha Ganguly
Madri Manish Mankad
S. V. Satayanarayana
G. M. Madhu
Publikationsdatum: 01.11.2015
Verlag: Springer US
Erschienen in: Journal of Materials Science / Ausgabe 21/2015
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-015-9261-0

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