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2018 | OriginalPaper | Buchkapitel

2. Lateral GaN HEMT Structures

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Abstract

This chapter describes the basic GaN-based HEMT device, including the polarization effects and surface states responsible for the formation of the 2DEG in AlGaN/GaN heterostructures. GaN HEMT device structure innovations for increasing the channel mobility, reducing the current collapse phenomena, achieving high voltage breakdown, and enabling normally off operation are presented.

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Literatur
1.
Zurück zum Zitat B.J. Baliga, Power semiconductor device figure of merit for high frequency applications. IEEE Electron Device Lett 10(10), 455–457 (1989)CrossRef B.J. Baliga, Power semiconductor device figure of merit for high frequency applications. IEEE Electron Device Lett 10(10), 455–457 (1989)CrossRef
2.
Zurück zum Zitat M.A. Khan et al., High electron mobility transistor based on a GaN-AlXGa1-XN heterojunction. Appl. Phys. Lett 63, 1214 (1993)CrossRef M.A. Khan et al., High electron mobility transistor based on a GaN-AlXGa1-XN heterojunction. Appl. Phys. Lett 63, 1214 (1993)CrossRef
3.
Zurück zum Zitat R. Vetury, Polarization induced 2DEG in AlGaN/GaN HEMTs: On the origin, DC, and transient characterization, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2000 R. Vetury, Polarization induced 2DEG in AlGaN/GaN HEMTs: On the origin, DC, and transient characterization, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2000
4.
Zurück zum Zitat T. Hanada, Basic properties of ZnO, GaN, and related materials, in Oxide and Nitride Semiconductors. Advances in Materials Research, ed. by T. Yao, S. K. Hong (Eds), vol. 12, (Springer, Berlin/Heidelberg, 2009) T. Hanada, Basic properties of ZnO, GaN, and related materials, in Oxide and Nitride Semiconductors. Advances in Materials Research, ed. by T. Yao, S. K. Hong (Eds), vol. 12, (Springer, Berlin/Heidelberg, 2009)
5.
Zurück zum Zitat U. Mishra, J. Singh, 8.6 polar materials and structures, in Semiconductor Device Physics and Design, Dordrecht, The Netherlands (Springer, 2007) U. Mishra, J. Singh, 8.6 polar materials and structures, in Semiconductor Device Physics and Design, Dordrecht, The Netherlands (Springer, 2007)
6.
Zurück zum Zitat D. Jena, Polarization induced electron populations in III-V nitride semiconductors transport, growth, and device applications, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2003 D. Jena, Polarization induced electron populations in III-V nitride semiconductors transport, growth, and device applications, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2003
7.
Zurück zum Zitat A.Q. Huang, New unipolar switching power device figures of merit. IEEE Electron Device Lett 43(10), 1717–1731 (1997) A.Q. Huang, New unipolar switching power device figures of merit. IEEE Electron Device Lett 43(10), 1717–1731 (1997)
8.
Zurück zum Zitat L. Hsu, W. Walukiewicz, Effect of polarization fields on transport properties in AlGaN/GaN heterostructures. J. Appl. Phys. 89, 1783–1789 (2001)CrossRef L. Hsu, W. Walukiewicz, Effect of polarization fields on transport properties in AlGaN/GaN heterostructures. J. Appl. Phys. 89, 1783–1789 (2001)CrossRef
9.
Zurück zum Zitat L. Shen et al., AlGaN/AlN/GaN high-power microwave HEMT. IEEE Electron Device Lett 22, 457–459 (2001)CrossRef L. Shen et al., AlGaN/AlN/GaN high-power microwave HEMT. IEEE Electron Device Lett 22, 457–459 (2001)CrossRef
10.
Zurück zum Zitat C.S. Suh et al., High-breakdown enhancement-mode AlGaN/GaN HEMTs with integrated slant field-plate, IEDM Technical Digest, pp. 911–913, Dec 2006 C.S. Suh et al., High-breakdown enhancement-mode AlGaN/GaN HEMTs with integrated slant field-plate, IEDM Technical Digest, pp. 911–913, Dec 2006
11.
Zurück zum Zitat Y. Hao et al., High-performance microwave gate-recessed AlGaN/AlN/GaN MOS-HEMT with 73% power-added Efficienty. IEEE Electron Device Lett 32, 626–628 (2011)CrossRef Y. Hao et al., High-performance microwave gate-recessed AlGaN/AlN/GaN MOS-HEMT with 73% power-added Efficienty. IEEE Electron Device Lett 32, 626–628 (2011)CrossRef
12.
Zurück zum Zitat L. Shen et al., Unpassivated GaN/AlGaN/GaN power high electron mobility transistors with dispersion controlled by epitaxial layer design. J. Electron. Mater. 33, 422–425 (2004)CrossRef L. Shen et al., Unpassivated GaN/AlGaN/GaN power high electron mobility transistors with dispersion controlled by epitaxial layer design. J. Electron. Mater. 33, 422–425 (2004)CrossRef
13.
Zurück zum Zitat R. Coffie et al., Impact of AlN Interlayer on Reliability of AlGaN/GaN HEMTs. IEEE 44th Annual international reliability physics symposium technical digest, pp. 99–102, 2006 R. Coffie et al., Impact of AlN Interlayer on Reliability of AlGaN/GaN HEMTs. IEEE 44th Annual international reliability physics symposium technical digest, pp. 99–102, 2006
14.
Zurück zum Zitat B.M. Green et al., The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs. IEEE Electron Device Lett 21, 268–270 (2000)CrossRef B.M. Green et al., The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs. IEEE Electron Device Lett 21, 268–270 (2000)CrossRef
15.
Zurück zum Zitat J. Derluyn et al., Improvement of AlGaN/GaN high electron mobility transistor structures by in situ deposition of Si3N4 surface layer. J. Appl. Phys. 98, 054501 (2005)CrossRef J. Derluyn et al., Improvement of AlGaN/GaN high electron mobility transistor structures by in situ deposition of Si3N4 surface layer. J. Appl. Phys. 98, 054501 (2005)CrossRef
16.
Zurück zum Zitat B. Heying et al., In situ SiN passivation of AlGaN/GaN HEMTs by molecular beam epitaxy. IEEE Electron Lett 43(14), 779–780 (2007) B. Heying et al., In situ SiN passivation of AlGaN/GaN HEMTs by molecular beam epitaxy. IEEE Electron Lett 43(14), 779–780 (2007)
17.
Zurück zum Zitat H. Jiang et al., Investigation of in situ SiN as gate dielectric and surface passivation for GaN MISHEMTs. IEEE Trans. Electron Devices 64(3), 832–839 (2017) H. Jiang et al., Investigation of in situ SiN as gate dielectric and surface passivation for GaN MISHEMTs. IEEE Trans. Electron Devices 64(3), 832–839 (2017)
18.
Zurück zum Zitat P. Moens et al., An insdustrial process for 650V rated GaN-on-Si power devices using in-situ SiN as a gate dielectric. Proceedings of the 26th international symposium on power semiconductor devices & IC’s, pp. 374–377, June 2014 P. Moens et al., An insdustrial process for 650V rated GaN-on-Si power devices using in-situ SiN as a gate dielectric. Proceedings of the 26th international symposium on power semiconductor devices & IC’s, pp. 374–377, June 2014
19.
Zurück zum Zitat A. Brannick et al., Modeling of hot electron effects in GaN/AlGaN HEMT with AlN interlayer, in Simulation of Semiconductor Processes and Devices, vol. 12, Springer, Vienna, pp. 281–284 (2007) A. Brannick et al., Modeling of hot electron effects in GaN/AlGaN HEMT with AlN interlayer, in Simulation of Semiconductor Processes and Devices, vol. 12, Springer, Vienna, pp. 281–284 (2007)
20.
Zurück zum Zitat J.S. Lee et al., Reduction of current collapse in AlGaN/GaN HFETs using AlN interfacial layer. IEEE Electron Lett 39(9), 750–752 (2003)CrossRef J.S. Lee et al., Reduction of current collapse in AlGaN/GaN HFETs using AlN interfacial layer. IEEE Electron Lett 39(9), 750–752 (2003)CrossRef
21.
Zurück zum Zitat S. Kaneko et al., Current-collapse-free Operations up to 850V by GaN-GIT utilizing Hole Injection from Drain. Proceedings of the 27th international symposium on power semiconductor devices & IC’s, pp. 41–44, May 2015 S. Kaneko et al., Current-collapse-free Operations up to 850V by GaN-GIT utilizing Hole Injection from Drain. Proceedings of the 27th international symposium on power semiconductor devices & IC’s, pp. 41–44, May 2015
22.
Zurück zum Zitat Y. Dora, Understanding material and process limits for high breakdown voltage AlGaN/GaN HEMTs, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2006 Y. Dora, Understanding material and process limits for high breakdown voltage AlGaN/GaN HEMTs, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2006
23.
Zurück zum Zitat N.-Q. Zhang et al., High breakdown GaN HEMT with overlapping gate structure. IEEE Electron Device Lett 21, 421–423 (2000)CrossRef N.-Q. Zhang et al., High breakdown GaN HEMT with overlapping gate structure. IEEE Electron Device Lett 21, 421–423 (2000)CrossRef
24.
Zurück zum Zitat W. Saito et al., High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior. IEEE Trans. Electron Devices 50, 2528–2531 (2003)CrossRef W. Saito et al., High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior. IEEE Trans. Electron Devices 50, 2528–2531 (2003)CrossRef
25.
Zurück zum Zitat N. Ikeda et al., High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on a 4 inch Si substrates and the suppression of current collapse. Proceedings of the 20th international symposium on power semiconductor devices & IC’s, pp. 287–290, May 2008 N. Ikeda et al., High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on a 4 inch Si substrates and the suppression of current collapse. Proceedings of the 20th international symposium on power semiconductor devices & IC’s, pp. 287–290, May 2008
26.
Zurück zum Zitat H. Xing et al., High breakdown voltage AlGaN-GaN HEMTs achieved by multiple field plates. IEEE Electron Device Lett 25, 161–163 (2004)CrossRef H. Xing et al., High breakdown voltage AlGaN-GaN HEMTs achieved by multiple field plates. IEEE Electron Device Lett 25, 161–163 (2004)CrossRef
27.
Zurück zum Zitat R. Chu et al., 1200-V normally off GaN-on-Si field-effect transistors with low dynamic on-resistance. IEEE Electron Device Lett 32, 632–634 (2011)CrossRef R. Chu et al., 1200-V normally off GaN-on-Si field-effect transistors with low dynamic on-resistance. IEEE Electron Device Lett 32, 632–634 (2011)CrossRef
28.
Zurück zum Zitat R. Coffie, Slant field plate model for field-effect transistors. IEEE Trans. Electron Devices 61, 2867–2872 (2014)CrossRef R. Coffie, Slant field plate model for field-effect transistors. IEEE Trans. Electron Devices 61, 2867–2872 (2014)CrossRef
29.
Zurück zum Zitat C.S. Suh et al., High-breakdown enhancement-Mode AlGaN/GaN HEMTs with integrated slant field-plate. Proceedings of the 2006 international electron device meeting, Dec 2006 C.S. Suh et al., High-breakdown enhancement-Mode AlGaN/GaN HEMTs with integrated slant field-plate. Proceedings of the 2006 international electron device meeting, Dec 2006
30.
Zurück zum Zitat C.S. Suh, Enhancement-mode GaN-based HEMTs for high-voltage switching applications, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2008 C.S. Suh, Enhancement-mode GaN-based HEMTs for high-voltage switching applications, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2008
31.
Zurück zum Zitat J. Wong et al., Novel asymmetric slant field plate Technology for High-Speed low-Dynamic RON E/D-mode GaN HEMTs. IEEE Electron Device Lett 38, 95–98 (2017)CrossRef J. Wong et al., Novel asymmetric slant field plate Technology for High-Speed low-Dynamic RON E/D-mode GaN HEMTs. IEEE Electron Device Lett 38, 95–98 (2017)CrossRef
32.
Zurück zum Zitat A. Nakajima, GaN-based super Heterojunction field effect transistor using the polarization junction concept. IEEE Electron Device Lett 32, 542–544 (2011)CrossRef A. Nakajima, GaN-based super Heterojunction field effect transistor using the polarization junction concept. IEEE Electron Device Lett 32, 542–544 (2011)CrossRef
33.
Zurück zum Zitat W. Saito et al., Recessed-gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications. IEEE Trans. Electron Devices 53, 356–362 (2006)CrossRef W. Saito et al., Recessed-gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications. IEEE Trans. Electron Devices 53, 356–362 (2006)CrossRef
34.
Zurück zum Zitat T. Oka, T. Nozawa, AlGaN/GaN recessed MIS-gate HEFT with high-threshold-voltage normally-off operation for power electronics applications. IEEE Electron Device Lett 29, 668–670 (2008)CrossRef T. Oka, T. Nozawa, AlGaN/GaN recessed MIS-gate HEFT with high-threshold-voltage normally-off operation for power electronics applications. IEEE Electron Device Lett 29, 668–670 (2008)CrossRef
35.
Zurück zum Zitat Y. Cai et al., High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment. IEEE Electron Device Lett 26, 435–437 (2005)CrossRef Y. Cai et al., High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment. IEEE Electron Device Lett 26, 435–437 (2005)CrossRef
36.
Zurück zum Zitat B. Lu et al., Enhancement-mode AlGaN/GaN HEMTs with high linearity fabricated by hydrogen plasma treatment. Device Research Conference, University Park, PA, pp. 59–60 (2009) B. Lu et al., Enhancement-mode AlGaN/GaN HEMTs with high linearity fabricated by hydrogen plasma treatment. Device Research Conference, University Park, PA, pp. 59–60 (2009)
37.
Zurück zum Zitat X. Hu et al., Enhancement mode AlGaN/GaN HFET with selectively grown pn junction gate. IEEE Electron Lett 36, 753–754 (2000)CrossRef X. Hu et al., Enhancement mode AlGaN/GaN HFET with selectively grown pn junction gate. IEEE Electron Lett 36, 753–754 (2000)CrossRef
38.
Zurück zum Zitat Y. Uemoto et al., Gate injection transistor (GIT) – A normally-off AlGaN/GaN power transistor using conductivity modulation. IEEE Trans. Electron Devices 54, 3393–3395 (2007)CrossRef Y. Uemoto et al., Gate injection transistor (GIT) – A normally-off AlGaN/GaN power transistor using conductivity modulation. IEEE Trans. Electron Devices 54, 3393–3395 (2007)CrossRef
39.
Zurück zum Zitat O. Hilt et al., Normally-off AlGaN/GaN HFET with p-type GaN Gate and AlGaN Buffer. Proceedings of The 22nd international symposium on power semiconductor devices & ICs, pp. 347–350, June 2010 O. Hilt et al., Normally-off AlGaN/GaN HFET with p-type GaN Gate and AlGaN Buffer. Proceedings of The 22nd international symposium on power semiconductor devices & ICs, pp. 347–350, June 2010
40.
Zurück zum Zitat K.-Y. Rong Wong et al., A next generation CMOS-compatible GaN-on-Si transistors for high efficiency energy systems. Proceedings of the 2006 international electron device meeting, pp. 229–232, Dec 2015 K.-Y. Rong Wong et al., A next generation CMOS-compatible GaN-on-Si transistors for high efficiency energy systems. Proceedings of the 2006 international electron device meeting, pp. 229–232, Dec 2015
41.
Zurück zum Zitat S. Heikman, MOCVD growth technologies for applications in AlGaN/GaN high electron mobility transistors, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2002 S. Heikman, MOCVD growth technologies for applications in AlGaN/GaN high electron mobility transistors, D.Phil. dissertation, Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, 2002
42.
Zurück zum Zitat H. Okita et al., Through recessed and regrowth gate technology for realizing process stability of GaN-GITs. Proceedings of The 28th international symposium on power semiconductor devices & ICs, pp. 23–26, June 2016 H. Okita et al., Through recessed and regrowth gate technology for realizing process stability of GaN-GITs. Proceedings of The 28th international symposium on power semiconductor devices & ICs, pp. 23–26, June 2016
Metadaten
Titel
Lateral GaN HEMT Structures
verfasst von
Chang Soo Suh
Copyright-Jahr
2018
DOI
https://doi.org/10.1007/978-3-319-77994-2_2

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