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2009 | OriginalPaper | Buchkapitel

11. Electrically Conductive Adhesives (ECAs)

verfasst von : Daoqiang Daniel Lu, C.P. Wong

Erschienen in: Materials for Advanced Packaging

Verlag: Springer US

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Abstract

Recently, significant advances have been made to improve electrically conductive adhesive (ECA) technology. Recent material development of various anisotropic conductive adhesives/films (ACAs/ACFs) and their applications are reviewed first and then recent research achievements in material development and in both electrical and mechanical aspects of isotropic conductive adhesives (ICAs) including electrical conductivity improvement, contact resistance mechanism elucidation and approaches to stabilize the contact resistance, and mechanical impact performance enhancement are reviewed in details.

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Vorheriges Kapitel Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

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Titel: Electrically Conductive Adhesives (ECAs)
verfasst von: Daoqiang Daniel Lu
C.P. Wong
Verlag: Springer US
Buch: Materials for Advanced Packaging
Print ISBN: 978-0-387-78218-8

Electronic ISBN: 978-0-387-78219-5

Copyright-Jahr: 2009
DOI: https://doi.org/10.1007/978-0-387-78219-5_11

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