Parametric Optimization for Photochemical Machining of Copper Using Grey Relational Method

The purpose of work is to study the parametric effect and optimization for Photochemical machining (PCM) of copper. The PCM has been carried out on copper by using ferric chloride as an etchant. The photo tool has been selected based on the analysis for better overall quality and minimum edge deviation. The experiments have been performed varying the (control parameters) concentration of etchant, temperature and the etching time. The performance of PCM has been analyzed for material removal rate (MRR) and edge deviation (ED). The MRR should be higher while the ED should be lesser. For satisfying this condition, multi-objective optimization has been carried out. The concentration of etchant and temperature have a significant effect on the performance of PCM of copper. The optimum conditions for PCM of copper have been presented. The photo tool analysis for selection of photo tool is very significant for achieving better results in PCM. The optimum set of parameters for PCM of copper has been given which will be helpful for further research in this area.