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Erschienen in: Journal of Nanoparticle Research 4/2008

01.04.2008 | Research Paper

Molecular dynamics simulations of structural disordering and forming defects in a milling process for selenium

verfasst von: Yoshiyuki Shirakawa, Yusuke Hayashi, Kazunori Kadota, Hiroshi Mio, Hiroto Ohtsuki, Atsuko Shimosaka, Jusuke Hidaka

Erschienen in: Journal of Nanoparticle Research | Ausgabe 4/2008

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Abstract

In our previous paper, structural changes of selenium powders ground by a planetary ball mill at various rotational speeds were investigated for the nanostructural modification of particles using mechanical grinding process. The experimental results indicated that the amorphisation of Se by grinding accompanies lattice strain, and the lattice strain arises from impact energy which is more than an energy related to intermolecular interaction. In this paper, molecular dynamics simulations of selenium have been carried out under compressing conditions of various pressure strengths for obtaining information of the lattice strain at atomic level. Then, dynamical behaviour of atomic configuration has been discussed in this process. The structural disordering and formation of the structural defects were estimated by deviations of bond length and angle and the number of created defects before and after compressing from simulated results. The disordering took place during compressing at various pressure strengths, and the disordered atoms return to their initial positions at lower pressure. Stable disordered state and defects after the compression can however remain by compression at more than a certain pressure strength mainly associated with binding energy of selenium.

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Metadaten
Titel
Molecular dynamics simulations of structural disordering and forming defects in a milling process for selenium
verfasst von
Yoshiyuki Shirakawa
Yusuke Hayashi
Kazunori Kadota
Hiroshi Mio
Hiroto Ohtsuki
Atsuko Shimosaka
Jusuke Hidaka
Publikationsdatum
01.04.2008
Verlag
Springer Netherlands
Erschienen in
Journal of Nanoparticle Research / Ausgabe 4/2008
Print ISSN: 1388-0764
Elektronische ISSN: 1572-896X
DOI
https://doi.org/10.1007/s11051-007-9287-6

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