2008 | OriginalPaper | Buchkapitel
Nanostructuring and Nanobonding by EBiD
verfasst von : Thomas Wich
Erschienen in: Automated Nanohandling by Microrobots
Verlag: Springer London
Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Since 1974, when Taniguchi coined the expression
nanotechnology
[1] as a description of manufacturing processes, a lot of different techniques for manufacturing on this small scale have been developed. Until that time, manufacturing processes on the micrometer scale used to be the limit. Conventional semiconductor-processing technologies are mostly limited by the achievable resolution in lithography. However, this resolution depends on the wavelength of light — or, in general, on electromagnetic waves. In order to process materials on the nanometer scale, it is either necessary to develop a new approach in materials structuring (often referred to as the bottom-up approach) or to extend the possibilities of common techniques, for example by using electromagnetic waves with considerably shorter wavelengths.