nach oben

Erschienen in:

2013 | OriginalPaper | Buchkapitel

Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach

verfasst von : Naotaka Tanaka

Erschienen in: Design of Adhesive Joints Under Humid Conditions

Verlag: Springer Berlin Heidelberg

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

We introduce a new adhesion test method for IC molding compounds that can experimentally separate residual stress from adhesion strength. This chapter describes the dependence of the measured true adhesion strength of molding compounds on adherent materials, temperature, and moisture absorption. We also evaluate interface delamination in a moisture-absorbed package by considering the swelling of the molding compound caused by moisture absorption. The predicted interface delamination agrees well with experimental data for moisture-soaked IC packages.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Vorheriges Kapitel Influence of Water on the Interface Properties

Nächstes Kapitel Prediction of Joint Strength Under Humid Conditions: Damage Mechanics Approach

Furusawa, I., Ishiguro, S., Nanbu, S.: Moisture resistance degradation of plastic LSIs by reflow soldering. In: Proceeding, 23th international reliability physics symposium, pp. 192–197 (1985)

Kitano, M., Nishimura, A., Kawai, R., Nishi, K.: Analysis of package cracking during reflow soldering process. In: Proceeding, 26th international reliability physics symposium, pp. 90–95 (1988)

Kitano, M., Nishimura, A., Kouno, R.: Development of damage detection system for surface mount package during reflow soldering. In: Proceeding, 41st electronic components and technology conference, pp. 615–620 (1991)

Bair, H.E., Boyle, D.J., Ryan, J.T., Taylor, C.R., Tighe, S.C., Crouthamel, D.L.: Thermomechanical properties of IC molding compounds. Polym. Eng. Sci. 30, 90–95 (1990)CrossRef

Nishimura, A., Tatemichi, A., Miura, H., Sakamoto, T.: Life estimation for IC plastic package under temperature cycling based on fracture mechanics. IEEE Trans. Compon. Hybrids Manuf. Technol. CPMT-10, 673–642 (1987)

Nishimura, A., Kawai, S., Murakami, G.: Effect of lead frame material on plastic-encapsulated IC Package cracking under temeperature cycling. IEEE Trans. Compon. Hybrids Manuf. Technol. 12, 639–645 (1989)CrossRef

Kim, S.: The role of plastic package adhesion in performance. IEEE Trans. Compon. Hybrids Manuf. Technol. 14, 809–817 (1991)CrossRef

Yoshioka, O., Okabe, N., Yamagishi, R., Nagayama, S., Murakami, G.: Improvement of moisture resistance in plastic encapsulation MOS-IC by surface finishing copper leadframe. In: Proceeding, 39^th electronic components and technology conference, pp. 464–471 (1989)

Malyshev, B., Salganik, R.L.: The strength of adhesive joints using the theory of cracks. Int. J. Fract. Mech. 1, 114–128 (1965)

10.

Kinloch, A.J.: The science of adhesion, part 2 mechanics and mechanism of failure. J. Mater. Sci. 17, 617–651 (1982)CrossRef

11.

Hattori, T., Sakata, S., Murakami, G.: A stress singularity parameter approach for evaluating the interfacial reliability of plastic encapsulated LSI devices. ASME J. Electron. Packag. 111, 243–248 (1989)CrossRef

12.

Nishimura, A., Hirose, I., Tanaka, N.: A new method for measuring adhesion strength of IC molding compounds. ASME J. Electron. Packag. 114, 407–412 (1992)CrossRef

13.

Tanaka, N., Nishimura, A.: Measurement of IC molding compound adhesion strength and prediction of interface delamination within package. ASME Adv. Electron. Packag. EEP-Vol. 10.2, 765–773 (1995)

14.

Tanaka, N., Kitano, M., Kumazawa, T., Nishimura, A.: Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling. IEEE Trans. Compon. Packag. Technol. 22(3):426–432 (1999)

15.

Sawyer, S.G., Anderson, R.B.: Collocated interfacial stress intensity factors for finite Bi-material plates. Eng. Fract. Mech. 4, 605–616 (1972)CrossRef

16.

Yuuki, R., Cho, S.B.: Efficient boundary element analysis of stress intensity factor for interface crack in dissimilar materials. Eng. Fract. Mech. 34, 179–188 (1989)CrossRef

17.

Ogata, M., Kinjo, N., Kawata, T.: Effects of crosslinking on physical properties of phenol-formaldehyde Novolac cured epoxy resins. J. Appl. Polym. Sci. 48, 583–601 (1993)CrossRef

Titel: Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach
verfasst von: Naotaka Tanaka
Verlag: Springer Berlin Heidelberg
Buch: Design of Adhesive Joints Under Humid Conditions
Print ISBN: 978-3-642-37613-9

Electronic ISBN: 978-3-642-37614-6

Copyright-Jahr: 2013
DOI: https://doi.org/10.1007/978-3-642-37614-6_6

Premium Partner

Marktübersichten

Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.

Zur Marktübersicht