2006 | OriginalPaper | Buchkapitel
Reliability of Interfaces Between Components in Advanced Electronic Packages under Solder Reflow Process
verfasst von : T. Ikeda, N. Miyazaki
Erschienen in: Fracture of Nano and Engineering Materials and Structures
Verlag: Springer Netherlands
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In order to the downsizing of electronic packages, complicated structures of adhesively jointed dissimilar materials are used in many advanced packages. In these packages, jointed interfaces are sometimes delaminated by the combined effects of thermal stress, vapor pressure during solder reflow process and so on. Qualitative analysis of the delamination is desired to develop effective materials and to perform reliable design to protect the delamination. In this study, we focused on the delamination in advanced electronic packages under solder reflow process.