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Journal of Materials Science

Ausgabe 21/2011

Inhalt (37 Artikel)

Methods for enhanced control over the density and electrical properties of SWNT networks

L. David Lipscomb, Pornnipa Vichchulada, Nidhi P. Bhatt, Qinghui Zhang, Marcus D. Lay

Bamboo fiber reinforced thermoplastic molding made of steamed wood flour

Isoko Takahashi, Takanori Sugimoto, Yasuo Takasu, Mariko Yamasaki, Yasutoshi Sasaki, Youji Kikata

Preparation and characterization of conductive carbon nanotube-polyurethane foam composites

Kyung Min You, Sang Sun Park, Choon Soo Lee, Ji Mun Kim, Gun Pyo Park, Woo Nyon Kim

The mechanical response of Rohacell foams at different length scales

S. Arezoo, V. L. Tagarielli, N. Petrinic, J. M. Reed

Optical thin film filters of colloidal gold and silica nanoparticles prepared by a layer-by-layer self-assembly method

Zaheer Abbas Khan, Rachana Kumar, Waleed S. Mohammed, Gabor L. Hornyak, Joydeep Dutta

Fabrication of polypyrrole/layered niobate nanocomposite and its electrochemical behavior

Juanjuan Ma, Heng Jiang, Ningze Zhuo, Jingfei Li, Jiawei Lu, Junyan Gong, Xingyou Xu, Zhiwei Tong

Fracture behavior of Cu-cored solder joints

Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jeongtak Moon, Heeman Choe

The isochronal δ → γ transformation of high Cr ferritic heat-resistant steel during cooling

Qiuzhi Gao, Yongchang Liu, Xinjie Di, Zhizhong Dong, Zesheng Yan

The phase stability in Cr–Ni and Cr–Mn duplex stainless steels

I. Calliari, M. Pellizzari, M. Zanellato, E. Ramous

Thermal stability of cryomilled nanocrystalline aluminum containing diamantane nanoparticles

K. Maung, R. K. Mishra, I. Roy, L.-C. Lai, F. A. Mohamed, J. C. Earthman

Influence of substrate and selenization temperatures on the growth of Cu2SnSe3 films

G. Hema Chandra, O. Lakshmana Kumar, R. Prasada Rao, S. Uthanna

Effect of alkalinity on the hydrothermal synthesis of Li2ZrO3 nanotube arrays

Limin Guo, Xiaohui Wang, Shaopeng Zhang, Caifu Zhong, Longtu Li

Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications

J. Liu, P. Kumar, I. Dutta, R. Raj, R. Sidhu, M. Renavikar, R. Mahajan

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