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2018 | OriginalPaper | Buchkapitel

1. The Global Integrated Circuit Supply Chain Flow and the Hardware Trojan Attack

verfasst von : Hassan Salmani

Erschienen in: Trusted Digital Circuits

Verlag: Springer International Publishing

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Abstract

The complexity of modern designs, the significant cost of research and development, and the shrinking time-to-market window heavily enforce the horizontal integrated circuit design flow. Many entities across the globe might be involved in the flow and none are necessarily trusted. A malicious party can implement a hardware Trojan attack through manipulating a circuit to undermine its characteristics under rare circumstances at different stages of the flow before and after circuit manufacturing. Detection of hardware Trojans using existing pre-silicon and post-silicon verification techniques is a very challenging task because of the complexity of modern designs, their verity of application, and limited time for verification. This chapter provides an overview on the global supply chain for integrated circuits and the hardware Trojan attack.

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Literatur
3.
Zurück zum Zitat K.M. Mohan, Outsourcing Trends in Semiconductor Industry, Massachusetts Institute of Technology, 2010 K.M. Mohan, Outsourcing Trends in Semiconductor Industry, Massachusetts Institute of Technology, 2010
5.
Zurück zum Zitat R. Saleh, S. Wilton, S. Mirabbasi, A. Hu, M. Greenstreet, G. Lemieux, P.P. Pande, C. Grecu, A. Ivanov, System-on-chip: reuse and integration. Proc. IEEE 94(6), 1050–1069 (2006)CrossRef R. Saleh, S. Wilton, S. Mirabbasi, A. Hu, M. Greenstreet, G. Lemieux, P.P. Pande, C. Grecu, A. Ivanov, System-on-chip: reuse and integration. Proc. IEEE 94(6), 1050–1069 (2006)CrossRef
6.
Zurück zum Zitat India Semiconductor and Embedded Design Service Industry (2007–2010), Market, Technology and Ecosystem Analysis (India Semiconductor Association, Bangalore, 2008) India Semiconductor and Embedded Design Service Industry (2007–2010), Market, Technology and Ecosystem Analysis (India Semiconductor Association, Bangalore, 2008)
7.
Zurück zum Zitat J. Villasenor, Compromised By Design? Securing the Defense Electronics Supply Chain (The Center for Technology Innovation at Brookings, Washington, 2013) J. Villasenor, Compromised By Design? Securing the Defense Electronics Supply Chain (The Center for Technology Innovation at Brookings, Washington, 2013)
9.
Zurück zum Zitat M.D. Platzer, J.F. Sargent Jr., U.S. semiconductor manufacturing: industry trends, global competition, federal policy (2016) M.D. Platzer, J.F. Sargent Jr., U.S. semiconductor manufacturing: industry trends, global competition, federal policy (2016)
11.
Zurück zum Zitat A. Avizienis, J.-C. Laprie, B. Randell, C. Landwehr, Basic concepts and taxonomy of dependable and secure computing. IEEE Trans. Dependable Secure Comput. 1(1), 11–33 (2004)CrossRef A. Avizienis, J.-C. Laprie, B. Randell, C. Landwehr, Basic concepts and taxonomy of dependable and secure computing. IEEE Trans. Dependable Secure Comput. 1(1), 11–33 (2004)CrossRef
12.
Zurück zum Zitat L.-T. Wang, C.-W. Wu, X. Wen, VLSI Test Principles and Architectures (Morgan Kaufmann Publishers, San Francisco, 2006) L.-T. Wang, C.-W. Wu, X. Wen, VLSI Test Principles and Architectures (Morgan Kaufmann Publishers, San Francisco, 2006)
13.
Zurück zum Zitat H. Salmani, M. Tehranipoor, R. Karri, On design vulnerability analysis and trust benchmarks development, in 2013 IEEE 31st International Conference on Computer Design, ICCD 2013, Asheville, NC, 6–9 October 2013, pp. 471–474 H. Salmani, M. Tehranipoor, R. Karri, On design vulnerability analysis and trust benchmarks development, in 2013 IEEE 31st International Conference on Computer Design, ICCD 2013, Asheville, NC, 6–9 October 2013, pp. 471–474
14.
Zurück zum Zitat W. Chen, S. Ray, J. Bhadra, M. Abadir, L.C. Wang, Challenges and trends in modern SoC design verification. IEEE Des. Test 34(5), 7–22 (2017)CrossRef W. Chen, S. Ray, J. Bhadra, M. Abadir, L.C. Wang, Challenges and trends in modern SoC design verification. IEEE Des. Test 34(5), 7–22 (2017)CrossRef
15.
Zurück zum Zitat P. Mishra, R. Morad, A. Ziv, S. Ray, Post-silicon validation in the SoC era: a tutorial introduction. IEEE Des. Test 34(3), 68–92 (2017)CrossRef P. Mishra, R. Morad, A. Ziv, S. Ray, Post-silicon validation in the SoC era: a tutorial introduction. IEEE Des. Test 34(3), 68–92 (2017)CrossRef
Metadaten
Titel
The Global Integrated Circuit Supply Chain Flow and the Hardware Trojan Attack
verfasst von
Hassan Salmani
Copyright-Jahr
2018
DOI
https://doi.org/10.1007/978-3-319-79081-7_1

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