Thermal Management of Low Volume Complex Electronic Systems

Advances in the field of electronics have resulted in a significant increase in density integration, clock rates, and emerging trend of miniaturization of modern electronics. This resulted in dissipation of high heat flux at the chip level. In order to satisfy the junction temperature requirements in terms of performance and reliability, improvements in cooling technologies are required. The task of maintaining acceptable junction temperature by dissipating the heat from the integrated circuit chips is a significant challenge to thermal engineers. Much work has been done on cooling one hot spot with one heat sink, but there has not been as much investigation into cooling multiple hot spots with a single heat sink. A circuit board with a specific geometry and chip arrangement will be cooled using a liquid-cooled cold plate.