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Journal of Materials Science
Erschienen in: Journal of Materials Science 7/2020

30.10.2019 | Metals & corrosion

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

verfasst von: Siliang He, Runhua Gao, Yu-An Shen, Jiahui Li, Hiroshi Nishikawa

Erschienen in: Journal of Materials Science | Ausgabe 7/2020

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Abstract

Fluxes have a negative impact on the environment; as a result, fluxless soldering has become a promising method in electronic packaging. However, detailed studies on fluxless soldering are very rare, especially those involving the use of electroless nickel immersion gold (ENIG) substrate under formic acid (FA) atmosphere that can effectively reduce the majority of solders. In this work, the characteristic parameters of FA reflow soldering performed by combining Sn–3.5Ag–0.5Cu (SAC305) solder and ENIG substrate are compared with the soldering conducted using liquid rosin mildly activated (RMA) flux. It is found that the wettability of FA-exposed solder is greater than that of RMA-containing solder because the former spreads across the interfacial layer of intermetallic compounds (IMCs) produced before the melting of SAC305. Additionally, the interfacial reactions of FA-exposed solder resemble those of RMA solder before and after the thermal aging at 150 °C. Therefore, the impact strengths of these two solders are almost the same due to the similarity of their microstructures and close growth rates of (Cu,Ni)6Sn5 IMC layers during thermal aging. The findings of this study suggest that FA reflow soldering is a promising environmentally friendly technique for electronic packaging.
Vorheriger Artikel Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys
Nächster Artikel Influence of temperature of ECAP processing on the microstructure and microhardness of as-cast AX41 alloy

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Metadaten
Titel
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
verfasst von
Siliang He
Runhua Gao
Yu-An Shen
Jiahui Li
Hiroshi Nishikawa
Publikationsdatum
30.10.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 7/2020
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-019-04153-9

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