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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 18/2018

19.07.2018

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles

verfasst von: Shengyan Shang, Anil Kunwar, Jinye Yao, Yunpeng Wang, Ning Zhao, Mingliang Huang, Haitao Ma

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 18/2018

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Abstract

Both \(\text {TiO}_{2}\) and Cu nanoparticles, when added at the interface of the Sn/Cu joints during reflow soldering at 250 °C  for 10, 60, 120 s and subsequent air cooling, are observed to reduce the growth of \(\text {Cu}_{6}\text {Sn}_{5}\) whiskers. Though both reinforcments reduce the vertical growth of intermetallic compound (IMC), only \(\text {TiO}_{2}\) could suppress the lateral growth of the compound. The solder saturation level with Cu at different reflow duration can influence final dimensions as well as morphology of IMC and occurrence of screw dislocation. The addition of \(\text {TiO}_{2}\), by intervening the mechanism of ostwald ripening during reflow can be utilized to enhance the solder-IMC bonding at interface.
Vorheriger Artikel Effect of rolling temperature on the microstructure and electric properties of β-polyvinylidene fluoride films
Nächster Artikel Influence of laser fluence on structural, optical and microwave dielectric properties of pulsed laser deposited Ba0.6Sr0.4TiO3 thin films

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Metadaten
Titel
All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles
verfasst von
Shengyan Shang
Anil Kunwar
Jinye Yao
Yunpeng Wang
Ning Zhao
Mingliang Huang
Haitao Ma
Publikationsdatum
19.07.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 18/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9682-z

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