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Erschienen in:

2011 | OriginalPaper | Buchkapitel

24. Analytical Approach to Joint Design

verfasst von : Prof. Liyong Tong, Quantian Luo

Erschienen in: Handbook of Adhesion Technology

Verlag: Springer Berlin Heidelberg

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Abstract

This chapter presents analytical approach for determining stress and strength of adhesively bonded joints. Selected applications of adhesively bonded joints are discussed first, and then mathematical models for stress analysis of these joints are outlined. Various closed-form solutions for adhesive stresses and edge bending moment for balanced single lap joints are presented and compared. The method for finding analytical solutions for asymmetric and unbalanced adhesive joints is also discussed. Explicit expressions for mode I and mode II energy release rates for cohesive failure and interfacial debonding are presented for asymmetric joints with a semi-infinitive length subjected to general load combinations.

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Vorheriges Kapitel Constitutive Adhesive and Sealant Models

Nächstes Kapitel Numerical Approach: Finite Element Analysis

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Titel: Analytical Approach to Joint Design
verfasst von: Prof. Liyong Tong
Quantian Luo
Verlag: Springer Berlin Heidelberg
Buch: Handbook of Adhesion Technology
Print ISBN: 978-3-642-01168-9

Electronic ISBN: 978-3-642-01169-6

Copyright-Jahr: 2011
DOI: https://doi.org/10.1007/978-3-642-01169-6_24

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