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1998 | OriginalPaper | Buchkapitel

Catastrophic Transformation of Electron Stress and Electron Stiffness Parameter on Metal and Semiconductor

verfasst von : Shigeo Kotake, Hiroyuki Kimata, Takashi Aoki, Yasuyuki Suzuki, Masafumi Senoo

Erschienen in: Mesoscopic Dynamics of Fracture

Verlag: Springer Berlin Heidelberg

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In this study, we calculated the quantum stress of electrons, called electron stress (ES), in a metal and a semiconductor under uniaxial tensile and compressive deformation (−50% to 50%) by using the pseudopotential method. Since the positions of atoms are fixed with external forces, the ES of a stationary electron shows the internal stress among atoms. From the derivative of ES with strain, we defined a “quantum stiffness parameter (ESP)”. We calculated ES and ESP in Al, K and Si during deformation. From the results of the calculation, we consider the following points: (i) Change of ES and ESP during deformation, (ii) ES and ESP demonstrate the difference between a metal and a semiconductor. During uniaxial tensile deformation, alter showing a gradual decrease, ESP shows a sudden divergence from positive to negative values at a certain critical strain. Under compression, a merely gradual increase of ESP was observed. Strain at the critical transformation of ESP, termed “critical strain (ε cr)”, shows a material dependence; 20% in Al, 30% in K, but only 2.5% in Si. The result of a low ε cr in Si and high ε cr values in metals corresponds to the general knowledge on mechanical properties of materials; metals are more ductile than semiconductors. The critical transitions of ES and ESP in solids could be explained from the electric properties in solids. These parameters might provide a key to understand ideal fractural properties in solid.

Metadaten
Titel
Catastrophic Transformation of Electron Stress and Electron Stiffness Parameter on Metal and Semiconductor
verfasst von
Shigeo Kotake
Hiroyuki Kimata
Takashi Aoki
Yasuyuki Suzuki
Masafumi Senoo
Copyright-Jahr
1998
Verlag
Springer Berlin Heidelberg
DOI
https://doi.org/10.1007/978-3-662-35369-1_17

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