2001 | OriginalPaper | Buchkapitel
Chemisorbed CF3I on a Silicon Surface
verfasst von : Jason E. Sanabia, John H. Moore
Erschienen in: Gaseous Dielectrics IX
Verlag: Springer US
Enthalten in: Professional Book Archive
Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
In plasma etching of silicon substrates, electron-impact on a halogen-containing feed gas creates chemically-active ions and radicals that react with silicon to form volatile SiXy (X = halogen) species. Unfortunately, the most widely-used feed gas, CF4, has a high global warming potential.1 As a consequence, other halocarbons are being considered as replacements for CF4. Trifluoroiodomethane, CF3I, is a promising candidate: It has a low global-warming potential2 and plasma-etching of silicon dioxide with CF3I has recently been demonstrated3-5.