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2001 | OriginalPaper | Buchkapitel

Chemisorbed CF3I on a Silicon Surface

verfasst von : Jason E. Sanabia, John H. Moore

Erschienen in: Gaseous Dielectrics IX

Verlag: Springer US

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In plasma etching of silicon substrates, electron-impact on a halogen-containing feed gas creates chemically-active ions and radicals that react with silicon to form volatile SiXy (X = halogen) species. Unfortunately, the most widely-used feed gas, CF4, has a high global warming potential.1 As a consequence, other halocarbons are being considered as replacements for CF4. Trifluoroiodomethane, CF3I, is a promising candidate: It has a low global-warming potential2 and plasma-etching of silicon dioxide with CF3I has recently been demonstrated3-5.

Metadaten
Titel
Chemisorbed CF3I on a Silicon Surface
verfasst von
Jason E. Sanabia
John H. Moore
Copyright-Jahr
2001
Verlag
Springer US
DOI
https://doi.org/10.1007/978-1-4615-0583-9_16

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