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Erschienen in:
1991 | OriginalPaper | Buchkapitel
Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces
verfasst von : Paul S. Ho, Richard Haight, Robert C. White, B. D. Silverman, F. Faupel
Erschienen in: Fundamentals of Adhesion
Verlag: Springer US
Enthalten in: Professional Book Archive
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In microelectronics, the large-scale integration of devices necessitates the use of multi-layered metallization structures on the chip level and for packaging. Such structures are usually fabricated using alternate metal and insulating layers. This incorporates metal—insulator interfaces throughout the structure which, depending on the configuration and dimension of the devices, can have varying degree of complexities. These interfaces have to be designed with certain functional characteristics, particularly good chemical and adhesion properties. For this purpose, it is important to understand these basic properties of the metal—insulator interface.