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Erschienen in:
2011 | OriginalPaper | Buchkapitel
11. Codeposition of Impurities
verfasst von : Dr. Yuliy D. Gamburg, Dr. Giovanni Zangari
Erschienen in: Theory and Practice of Metal Electrodeposition
Verlag: Springer New York
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Abstract
Practically all the chemical species present in an electroplating solution can eventually be incorporated as impurities in electrochemically deposited metals. However, the mechanism and kinetics of their incorporation by the growing deposit can differ widely; similarly, the qualitative relationships between the concentration of impurity atoms in the solution and in the deposit and also their chemical state may vary significantly. For example, the relative content of the elements in the deposit can be higher than in the solution, or the same quantity can be lower by several orders of magnitude, depending on the mechanism of incorporation.