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Erschienen in:
2007 | OriginalPaper | Buchkapitel
Conductive Adhesives vs. Solder Paste: A Comparative Life Cycle Based Screening
verfasst von : Anders S. G. Andrae, Norihiro Itsubo, Hiroshi Yamaguchi, Atsushi Inaba
Erschienen in: Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses
Verlag: Springer London
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Electrically conductive adhesives (ECA) could soon constitute a realistic alternative to solders. The present research compares 10Sn90Pb solder paste in Japan to an epoxy based and isotropical ECA containing pure silver. The findings are that the silver containing adhesive likely is environmentally more advantageous than 10Sn90Pb. Environmental trade-offs exist especially between the ecotoxicity of Sn1090Pb and the resource consumption of silver-epoxy ECA. Palladium is significant platings included. Overall, the next steps would be to use improved global LCI metal production models and also to compare the life cycle cost to the social cost.