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Journal of Materials Science

Erschienen in:

01.03.2014

Creep deformation behavior of Sn–Zn solder alloys

verfasst von: Triratna Shrestha, Srikant Gollapudi, Indrajit Charit, K. Linga Murty

Erschienen in: Journal of Materials Science | Ausgabe 5/2014

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Abstract

Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50–75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.

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Titel: Creep deformation behavior of Sn–Zn solder alloys
verfasst von: Triratna Shrestha
Srikant Gollapudi
Indrajit Charit
K. Linga Murty
Publikationsdatum: 01.03.2014
Verlag: Springer US
Erschienen in: Journal of Materials Science / Ausgabe 5/2014
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-013-7905-5

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