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Surface Engineering and Applied Electrochemistry

Erschienen in:

01.02.2023

Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches

verfasst von: Xu Wang, Weiwu Ma, Carlos Fernandez

Erschienen in: Surface Engineering and Applied Electrochemistry | Ausgabe 1/2023

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Abstract

Electroless silver bottom-up filling has been designed and investigated by linear sweep voltammetry. It was found that the addition of polyethylene glycol 4000 (PEG 4000) had a good inhibitory effect on the electrode reaction. Experiments showed that PEG 4000 had a strong depressing action in electroless silver deposition. Specifically, when the PEG 4000 concentration was 1.0 mg/L, the plating rate of electroless silver decreased from 5.7 to 2.3 μm/h. The bottom-up silver fillings for different-sized trenches were achieved in an electroless plating bath with the addition of PEG 4000. The trenches analysis showed that all microtrenches with different widths were completely filled by electroless silver plating.

Vorheriger Artikel Chemical Etching of Cu98Be Alloy in Electrolyte Solutions

Nächster Artikel Kinetics and Mechanism of Electroless Silver Deposition on a Polyurethane Substrate at Moderate to High Concentration of Metal Precursor and Reductant

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Titel: Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches
verfasst von: Xu Wang
Weiwu Ma
Carlos Fernandez
Publikationsdatum: 01.02.2023
Verlag: Pleiades Publishing
Erschienen in: Surface Engineering and Applied Electrochemistry / Ausgabe 1/2023
Print ISSN: 1068-3755
Elektronische ISSN: 1934-8002
DOI: https://doi.org/10.3103/S1068375523010143

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