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2017 | OriginalPaper | Buchkapitel

23. Dynamic Mechanical Thermal Analysis of Epoxy/Thermoplastic Blends

verfasst von : Angel Romo-Uribe

Erschienen in: Handbook of Epoxy Blends

Verlag: Springer International Publishing

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Abstract

Epoxy/thermoplastic blends have been primarily developed to meet requirements in high-performance applications rendering toughness to the epoxy resins without sacrificing thermal resistance and mechanical performance. Engineering thermoplastics are the natural choice having high glass transition temperature, high thermal degradation temperatures, and impact resistance. The challenge is to understand and control phase separation in these systems and determine the correlation with mechanical properties. This chapter presents the application of dynamic mechanical thermal analysis (DMTA) as a suitable analytical tool to investigate the mechanical behavior and energy dissipation of epoxy resins modified with thermoplastics and aspects and consequences of miscibility, partial miscibility, or phase separation between thermoplastic domains and epoxy matrix. The type of thermoplastics utilized (amorphous vs. semicrystalline) and the influence of curing agents and curing temperature on the phase separation dynamics and nanophase of epoxy thermosets are discussed. Finally, application of DMTA to design and characterize the performance of a new generation of smart epoxy/thermoplastic blends with self-healing and shape memory properties is also discussed.

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Vorheriges Kapitel Cure Kinetics of Epoxy/Thermoplastic Blends

Nächstes Kapitel Thermal Properties of Epoxy/Thermoplastic Blends

Epoxy Resins

DGEBA

Diglycidyl ether of bisphenol A

DGEBF

Diglycidyl ether of bisphenol F

DGEBS

Diglycidyl ether of bisphenol S

FTGPAP

Triglycidylparaaminophenol

TGAP

Triglycidyl p-aminophenol

TGDDM

Tetraglycidyl 4,4′-diaminediphenylmethane

Hardeners

BAC

1,3-Bisaminomethylcyclohexane

DDM

4,4′-Diaminodiphenylmethane

DDS

4,4′-Diaminodiphenylsulfone

DETDA

3,5-Diethyltoluene-2,4-diamine or 3,5-diethyltoluene-2,6-diamine

DICY

Dicyandiamide

EMI-2,4

2-Ethylene-4-methane-imidazole

MCDEA

4,4′-Methylene bis[3-chloro-2,6-diethylaniline]

MDEA

4,4′-Methylenebis(2,6-diethylaniline)

MTHPA

Methyltetrahydrophthalic anhydride

TETA

Triethylenetetramine

3DCM

4,4′-Diamino-3,3′-dimethyidicyclohexylmethane

3,3′-DDS

3,3′-Diaminodiphenylsulfone

Thermoplastics

ABS

Acrylonitrile-butadiene-styrene

ATPDMS

Diaminopropyl-terminated polydimethylsiloxane

HBP

Hydroxy-functionalized hyperbranched polymer

HTPDMS

Dihydroxypropyl-terminated PDMS

Polyamide

PAEK

Poly(aryl ether ketone)

Poly(butadiene)

PBT

Poly(butylene terephthalate

PBzMA

Poly(benzyl methacrylate)

Polycarbonate

PCL

Poly(ε-caprolactone)

PDMS

Polydimethylsiloxane

PEEKOH

Hydroxyl-terminated poly(ether ether ketone) based on tert-butyl hydroquinone

PEEKT

Poly(ether ether ketone) based on tertiary butyl hydroquinone

PEES

Polyetherethersulfone

PEI

Polyetherimide

PEK-C

Phenolphthalein poly(ether ether ketone

PENT

Poly(cyanoarylene ether)

PEO

Poly(ethylene octene)

PES

Poly(ether sulfone)

PESEK

Poly(ether sulfone ether ketone

Polyimide

PMI

Poly(phenylmaleimide)

PMMA

Poly(methyl-methacrylate)

Poly(propylene)

PPE

Poly(phenylene ether)

PPE

Poly(2,6-dimethyl-1,4-phenylene ether)

PPO

Poly(2,6-dimethyl-1,4-phenylene oxide or poly(propylene oxide)

PPSu

Poly(phenyl sulfone)

Poly(styrene)

PSu

Polysulfone

Poly(urethane)

PVAc

Poly(vinyl acetate)

PVP

Poly(N-vinyl pyrrolidone)

RTPSA

Amine-terminated polysulfones

SAN

Poly(styrene-co-acrylonitrile)

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Titel: Dynamic Mechanical Thermal Analysis of Epoxy/Thermoplastic Blends
verfasst von: Angel Romo-Uribe
Verlag: Springer International Publishing
Buch: Handbook of Epoxy Blends
Print ISBN: 978-3-319-40041-9

Electronic ISBN: 978-3-319-40043-3

Copyright-Jahr: 2017
DOI: https://doi.org/10.1007/978-3-319-40043-3_23

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