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Tribology Letters
Erschienen in: Tribology Letters 3/2019

01.09.2019 | Original Paper

Effect of Adding Tungsten Disulfide to a Copper Matrix on the Formation of Tribo-Film and on the Tribological Behavior of Copper/Tungsten Disulfide Composites

verfasst von: Lin Zhao, Pingping Yao, Taiming Gong, Haibin Zhou, Minwen Deng, Zonghao Wang, Zhongyi Zhang, Yelong Xiao, Fenghua Luo

Erschienen in: Tribology Letters | Ausgabe 3/2019

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Abstract

The tribological behavior and formation of tribo-film of copper/tungsten disulfide (WS2) composites featuring 0–30% WS2 volume fractions, prepared using spark plasma sintering were investigated. Results indicated that WS2 as addition into the copper matrix could effectively reduce the coefficient of friction (COF) of Cu/WS2 composites. The lowest COF obtained was 0.16, while the wear rate was approximately 5 × 10−5 mm3·N− 1·m−1 for the Cu/WS2 composite which contained 25vol% of WS2 (here defined as Cu-25WS2). X-ray photoelectron spectroscopy and transmission electron microscopy analyses indicated that an oxygen-rich tribo-film with a thickness of approximately 10 nm was formed on the wear track, while a thick layer which was rich in WS2 and Cu2S and with a thickness of approximately 50 nm was observed below the oxygen-rich tribo-film. The superior tribological properties could ascribed to the formation of these tribo-films.
Vorheriger Artikel Matching Atomistic Simulations and In Situ Experiments to Investigate the Mechanics of Nanoscale Contact
Nächster Artikel Tribological Performance of Graphene and PTFE Solid Lubricants for Polymer Coatings at Elevated Temperatures

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Metadaten
Titel
Effect of Adding Tungsten Disulfide to a Copper Matrix on the Formation of Tribo-Film and on the Tribological Behavior of Copper/Tungsten Disulfide Composites
verfasst von
Lin Zhao
Pingping Yao
Taiming Gong
Haibin Zhou
Minwen Deng
Zonghao Wang
Zhongyi Zhang
Yelong Xiao
Fenghua Luo
Publikationsdatum
01.09.2019
Verlag
Springer US
Erschienen in
Tribology Letters / Ausgabe 3/2019
Print ISSN: 1023-8883
Elektronische ISSN: 1573-2711
DOI
https://doi.org/10.1007/s11249-019-1200-9

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