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Erschienen in: Journal of Materials Science: Materials in Electronics 11/2019

06.05.2019

Effect of Cu on microstructure, magnetic properties of antiperovskite nitrides CuxNFe4−x

verfasst von: Wei Wang, Xucai Kan, Xiansong Liu, Shuangjiu Feng, Chaocheng Liu, Khalid Mehmood Ur Rehman, Mudssir Shezad, Qiuyue Wu, Yuanyuan Wang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 11/2019

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Abstract

For soft magnetic materials, especially new intermetallic compounds, some good soft magnetic properties, such as high permeability, low power loss, as well as superior DC-bias properties, will determine their prospects for application. In this paper, we report soft magnetic properties of CuxNFe4−x, prepared by a new synthetic method. Although the saturation magnetization of the samples is slightly lower than that of Fe4N due to Cu doping, various other experimental results clearly provide evidence that the Fe substitution by Cu leads to the optimization and improvement of soft magnetic properties in Fe4N. With increasing Cu content, the permeability increases and power loss reduces from 1064.5 mW/cm3 for x = 0.1 to 679 mW/cm3 for x = 0.5 at H = 8 A/m, f = 1000 kHz. Additionally, the value of DC-bias (μH/μH=0) rises above 82% at H = 100 Oe, implying a superior DC-bias properties. More importantly, with the increases of x content, the value of μH/μH=0 increases and reaches 87% for sample x = 0.5 at H = 100 Oe. The improvement of soft magnetic properties of the Fe-based antiperovskite CuxNFe4−x is encouraging for future applications as functional materials.

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Metadaten
Titel
Effect of Cu on microstructure, magnetic properties of antiperovskite nitrides CuxNFe4−x
verfasst von
Wei Wang
Xucai Kan
Xiansong Liu
Shuangjiu Feng
Chaocheng Liu
Khalid Mehmood Ur Rehman
Mudssir Shezad
Qiuyue Wu
Yuanyuan Wang
Publikationsdatum
06.05.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 11/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01377-y

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