Effect of Process Parameters on Response Measures of Cartridge Brass Material in Photo Chemical Machining

Now a days to produce stress free and burr free micro components, photochemical machining is one of the emerging technologies. The micro level etching of components of different materials is carried out by using chemical etching process. The very precision parts such as microchannels, heat sinks, Fine mesh or screens and printed circuit boards are developed by this process. In this work, the cartridge brass was selected as a base metal which has good electrical and thermal conductivity. The process parameters are etching temperature and time and responses are etching depth and surface roughness. The objective of this study is to achieve etching depth on the Cartridge brass plate having thickness 0.5 mm. The etching depth and surface roughness of material increases with increase in time and temperature. The study of copper and brass were reported by many researchers. Very few literatures are available on an alloy of copper and brass. The effect of process parameters is changing by changing composition of material. This article is focused on the study of etching depth and surface roughness of cartridge brass material at different time and temperature. The cartridge brass has been widely used in industrial applications.