Vitesco Technologies has developed a new power module that is scheduled for market launch in 2025. The overmold technology used should make it possible to produce an extremely robust module.
New power module goes into series production in 2025
Vitesco Technologies
The power module from Vitesco Technologies, manufactured using the transfer molding process, consists of three overmolded half-bridges. The power electronics are sealed under a dielectric material that protects the components particularly well in combination with an efficient cooling interface. The new power modules combine silicon carbide chip technology with overmolding to provide a particularly robust product with increased power density, lower costs and reduced weight.
The power electronics control the drive energy and recuperation in high-voltage electric vehicles. Vitesco Technologies has been using the transfer molding technology since 2020 for compact transmission control units, among other things. The power modules will be manufactured at Vitesco Technologies' Nuremberg electronics plant and supplied to a major global automaker from mid-2025.