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Erschienen in:
01.06.2009
Electroplating of gold from a solution containing tri-ammonium citrate and sodium sulphite
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2009
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Abstract
In this work, a simple non-cyanide gold plating bath has been developed. The slightly acidic electrolyte containing tri-ammonium citrate, KAuCl4 and Na2SO3 has been utilized as the stable gold solution. It is environmentally benign, easy to prepare, easy to control and electrodeposition can be done at room temperature. Plating rates of about 10 μm/h at a current density of 4 mA/cm2 are attainable from a bath (pH 5.5) with 0.411 mol/L (100 g/L) of tri-ammonium citrate, 0.066 mol/L (25 g/L) of KAuCl4 and 0.543 mol/L (68.5 g/L) of Na2SO3. The resultant deposits are dense, with smooth morphology on both blank wafers and patterned wafers.