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Erschienen in: Journal of Materials Science 3/2017

14.10.2016 | Original Paper

Employing Al buffer layer with Al droplets-distributed surface to obtain high-quality and stress-free GaN epitaxial films on Si substrates

verfasst von: Haiyan Wang, Wenliang Wang, Weijia Yang, Yunnong Zhu, Zhiting Lin, Guoqiang Li

Erschienen in: Journal of Materials Science | Ausgabe 3/2017

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Abstract

Al buffer layers with Al droplets-distributed surface have been employed to grow high-quality and stress-free GaN epitaxial films on Si substrates. The Al droplets are proved to efficiently improve the quality of as-grown GaN. On the one hand, they can act as nucleation seeds to facilitate the epitaxial growth, improving the crystalline quality and surface morphology of as-grown GaN epitaxial films. On the other hand, they also can compensate the huge compressive stress produced by Al buffer layer during the cooling process, achieving stress-free film. The density and volume of Al droplets greatly impact the properties of as-grown GaN epitaxial films. The GaN epitaxial film grown on the Al buffer layer with many small Al droplets uniformly distributed on it shows the best crystalline quality with the full-width at half maximum (FWHM) of GaN(0002) and GaN(10–12) as 0.5° and 0.7°, respectively, and flat surface with the smallest surface root-mean-square roughness of 3.8 nm. In addition, it also exhibits relatively better photoelectric properties with an FWHM of near band gap emission peak of 18 nm, carrier concentration of 2.0 × 1017 cm−3, and mobility of 137.1 cm2/Vs. This work has revealed the advantages of Al buffer layer and the important effects of buffer layer surface on achieving high-quality GaN by PLD, which is of significance for various applications of GaN-based devices.

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Metadaten
Titel
Employing Al buffer layer with Al droplets-distributed surface to obtain high-quality and stress-free GaN epitaxial films on Si substrates
verfasst von
Haiyan Wang
Wenliang Wang
Weijia Yang
Yunnong Zhu
Zhiting Lin
Guoqiang Li
Publikationsdatum
14.10.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 3/2017
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-016-0427-1

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