Experimental Mechanics

Letter from the technical editor

Laser-induced stress wave thermometry applied to silicon wafer processing: Modeling and experimentation

G. A. Rabroker, C. S. Suh, R. Chona

Study of three-dimensional deformation of a pallet using phase-shiff shadow moiré and finite-element analysis

M. M. Ratnam, J. H. Lim, H. P. S. Abdul Khalil

Pattern evaluation for in-plane displacement measurement of thin films

P. Thota, J. Leifer, S. W. Smith, J. K. Lumpp

Inverse method to determine elastic constants using a circular disk and moiré interferometry

Z. Wang, J. F. Cárdenas-García, B. Han

Prediction of bond failure and deflection of carbon fiber-reinforced plastic reinforced concrete beams

A. Maji, A. L. Orozco

A new photoelastic model for studying fatigue crack closure

M. N. Pacey, M. N. James, E. A. Patterson

Mechanical characterization and modeling of polymeric materials for high-pressure sealing

A. Avanzini

Deformation measurement by phase-shifting digital holography

Y. Morimoto, T. Nomura, M. Fujigaki, S. Yoneyama, I. Takahashi

Three-dimensional point cloud registration by matching surface features with relaxation labeling method

N. Li, P. Cheng, M. A. Sutton, S. R. McNeill

Residual stress analysis near a cold expanded hole in a textured alclad sheet using X-ray diffraction

J. C. P. Pina, A. M. Dias, P. F. P. de Matos, P. M. G. P. Moreira, P. M. S. T. de Castro

Monitoring surface breaking defects with piezoelectric active systems

S. R. K. Morikawa, A. L. Gama, A. M. B. Braga, R. R. Correia

Full-scale, low-temperature mechanical testing of prestressing systems

R. Christen, A. Bergamini, K. Ghazi Wakili