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Erschienen in:
2016 | OriginalPaper | Buchkapitel
6. Failure Analysis of Electrical Interconnections and Recommended Processes
verfasst von : Barrie D. Dunn
Erschienen in: Materials and Processes
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Abstract
There are several classifications of processes which will metallurgically join parts as utilized in the production of electronic circuitry. These interconnection techniques are usually formed by the application or generation of heat, and, depending on the temperatures attained, are generally referred to as soldering, brazing, or welding. Where once dissimilar metals have been in contact, the joining temperatures produce a continuous volume of metal or metal alloy that is intended to enhance the electrical properties of the joint and preclude interfacial corrosion.