Anzeige
Erschienen in:
01.01.2012 | Editorial
Featured issue: Lead-free solder and packaging
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2012
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Excerpt
In the first two issues of 2012 we are highlighting fields which are topics of particular current interest in our discipline. The first of these is ‘Lead-free solder and packaging’. Since the Special Issue published in this journal in 2007 (J. Mater. Sci: Mater. Electron 18:1–365, 2007) on ‘Lead-Free Electronic Solders’ which was ably edited by our colleague and Guest Editor, Professor K.N. Subramanian, this and other journals have received many papers on this subject, which is vital to our field. As Prof. Subramanian pointed out, in his Preface to that issue,…Leaching of toxic lead from electronic wastes can result in contamination of the human food chain causing serious health hazards. As a consequence, several European and Pacific Rim countries have passed legislations warranting elimination of lead from electronic solders by fast approaching deadlines. Global economic pressures brought on by such legislations have resulted in a flurry of research activities to find suitable lead-free substitutes for the traditional leaded electronic solders.