High performance polyetherketone-hexagonal boron nitride nanocomposites for electronic applications

High-performance polymeric nanocomposites have been increasingly demanded by many cutting-edge fields. In present work, high-performance polymeric nanocomposites based on polyetherketone polymer as a matrix and hexagonal boron nitride (h-BN) nanopowder as reinforcement were successfully fabricated using planetary ball milling followed by hot pressing. The effects of h-BN loading (0–30 wt%) on the thermal stability, linear coefficient of thermal expansion (CTE), Vickers microhardness, and storage modulus/loss modulus were systematically investigated and discussed. Scanning electron microscopy showed good dispersion of h-BN nanoparticles into the matrix. The thermal stability of the nanocomposites was found more than 560 °C which is higher than that of commercial epoxy/E-glass based substrate. The linear CTE of the 30 wt% h-BN nanocomposite decreased approximately 20% compared to that of pure matrix. The microhardness and storage modulus of the nanocomposites were found to increase approximately 38% and 70%, respectively. Moreover, the glass transition temperature of the nanocomposites was increased compared to that of pure matrix.