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Polymer Science, Series D
Erschienen in: Polymer Science, Series D 2/2023

01.06.2023

Influence of a Binder Composition Containing Diaplast Phenoxy Thermoplastic Resin on Properties of a Low-Viscosity Resin for Injection Technologies

verfasst von: I. V. Terekhov, P. A. Kuznetsova, A. S. Lubimova, A. I. Tkachuk

Erschienen in: Polymer Science, Series D | Ausgabe 2/2023

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Abstract

The paper considers the binder systems based on epoxy resins combined with the Diaplast thermoplastic phenoxy resin destined to stabilize preforms based on various reinforcing fillers. We revealed their influence on the main technological and operational properties of a low-viscosity matrix and discovered that the binders based on the high-viscosity ED-8 epoxy resin affect slightly the rheological matrix characteristics; however, they might increase its fracture toughness.
Vorheriger Artikel A Neural Network Approach to Processing Photos of Carbon-Fiber-Reinforced Polymer Microstructures for Their Further Diagnostics
Nächster Artikel Features of the 1,3,5-Trioxane Stabilization Process

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Metadaten
Titel
Influence of a Binder Composition Containing Diaplast Phenoxy Thermoplastic Resin on Properties of a Low-Viscosity Resin for Injection Technologies
verfasst von
I. V. Terekhov
P. A. Kuznetsova
A. S. Lubimova
A. I. Tkachuk
Publikationsdatum
01.06.2023
Verlag
Pleiades Publishing
Erschienen in
Polymer Science, Series D / Ausgabe 2/2023
Print ISSN: 1995-4212
Elektronische ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421223020430

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