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Erschienen in:
01.11.2013
Influence of annealing temperature on the properties of polycrystalline silicon films formed by rapid thermal annealing of a-Si:H films
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 11/2013
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Abstract
In this work, rapid thermal annealing (RTA) was employed to crystallize the amorphous silicon films deposited by hot-wire chemical vapor deposition. The influence of annealing temperature on structural and electrical properties was studied by Raman spectroscopy, X-ray diffraction, scanning electron microscopy, Fourier transform infrared spectroscopy and temperature-dependent conductivity measurement. The results show that the amorphous silicon films can be successfully crystallized by RTA in a very short time. The crystallinity and electrical properties of the poly-Si films was greatly improved as the RTA temperature increasing. When the temperature higher than 900 °C, the poly-Si films obtained the crystalline fraction above 95 %, and the hydrogen atoms almost disappeared in the poly-Si films. At the temperature of 1,100 °C, polycrystalline silicon films with conductivity of 16.4 S cm−1 is obtained, which is seven orders in magnitude higher than that of the film annealed at 700 °C.