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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 8/2016

18.04.2016

Interface singular field analysis and thermal fatigue failure of solder joint in a stacked electronic modules

verfasst von: Xiao-guang Huang, Zhong-ying Han

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2016

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Abstract

Thermal fatigue failure of an electronic package usually initiates from the interface of solder joints for the mismatch deformation. Because of the viscoelastic creep properties of the solder, the interfacial stress–strain are intrinsically time dependent. The constitutive relationship of two solder materials, Sn–3Ag–0.5Cu and Pb–5Sn are established by creep test. The thermal-structural analysis of the whole stacked chipset during power on/off cycles are conducted. The time dependent stress–strain singular field at the solder–substance interface are obtained by sub-model technique and the singular field parameters are quantitatively evaluated. Furthermore, the thermal fatigue cracking is experimentally measured, and the singular stresses and strains at the interface are discussed with respect to thermal fatigue failure.
Vorheriger Artikel Auto-combustion preparation and characterization of lanthanum titanate nanoparticles by using tyrosine as fuel and its photocatalyst application
Nächster Artikel Quantitative structural analysis, phase transition and relaxor nature of Bi0.5Li0.5TiO3 ceramic prepared by mechanical alloying

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Metadaten
Titel
Interface singular field analysis and thermal fatigue failure of solder joint in a stacked electronic modules
verfasst von
Xiao-guang Huang
Zhong-ying Han
Publikationsdatum
18.04.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 8/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-4838-1

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