nach oben

Acoustical Physics

Erschienen in:

01.08.2023 | PHYSICAL ACOUSTICS

Investigation of Ultra-Wide Acoustic Bandgap of Nano Phononic Crystals in GHZ Frequency Ranges with Delay Line Configuration

verfasst von: M. A. Khan

Erschienen in: Acoustical Physics | Ausgabe 4/2023

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

The existence of an ultra-wide acoustic bandgap of novel nanophononic crystal in gigahertz (GHz) frequency ranges for a one-dimensional (1D) in the “out-of-plane” modes, and a two-dimensional (2D) in the “out-of-plane” modes is investigates. The maximum bandgap ratio up-to 141% for ultra-high frequency range of phononic crystal is also investigated. The results demonstrate that the transmission spectrum amplitude and bandgap of phononic crystal strongly agree in the same frequency region. It has been investigated that when the resonator is employed with phononic crystal the Q_anchor increase from 6340 to 7.65 × 10¹⁰. So the quality Q of resonator is boost very high, and the insertion loss is reduced to 91.98% by employing the proposed nanophononic crystal to resonator. Furthermore, this work verifies the propagation of acoustic waves is completely banned through proposed nanophononic crystal, and the transmission response of this phononic crystal is also verified by delay line configurations.

Vorheriger Artikel Acousto-Optic Scanning of a Laser Beam Along a Reconfigurable Circular Trajectory

Nächster Artikel Determination of the Acoustic Wave Velocity and Attenuation in Liquids with Different Acoustic Impedances Using an Acoustic Interferometer

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Y. M. Soliman, M. F. Su, Z. C. Leseman, C. M. Reinke, I. El-Kady, and R. H. Olsson, Appl. Phys. Lett. 97 (19) (2010). https://doi.org/10.1063/1.3504701

M. H. Lu, L. Feng, and Y. F. Chen, Mater. Today 12 (12), 34 (2009). https://doi.org/10.1016/S1369-7021(09)70315-3CrossRef

R. Lucklum, M. Zubtsov, and S. V. Arango, in Proc. ASME Int. Mechanical Engineering Congress and Exposition (IMECE) (Montreal, 2014). https://doi.org/10.1115/IMECE2014-38222

J. Mei, G. Ma, M. Yang, Z. Yang, W. Wen, and P. Sheng, Nat. Commun. 3 (1), 1 (2012). https://doi.org/10.1038/ncomms1758CrossRef

L. Zigoneanu, B. I. Popa, and S. A. Cummer, Nat. Mater. 13 (4), 352 (2014). https://doi.org/10.1038/nmat3901ADSCrossRef

T. Yildirim, et al., Nanoscale 12 (44), 22366 (2020). https://doi.org/10.1039/D0NR06773CCrossRef

T. Jiang, Q. He, and Z. K. Peng, Appl. Phys. Lett. 112 (26) (2018). https://doi.org/10.1063/1.5024970

N. Skivesen, A. Têtu, M. Kristensen, J. Kjems, L. H. Frandsen, and P. I. Borel, Opt. Express 15 (6), 3169 (2007). https://www.osapublishing.org/oe/abstract.cfm?uri=oe-15-6-3169.ADSCrossRef

E. Yablonovitch, Phys. Rev. Lett. 58 (20), 2059 (1987). https://doi.org/10.1103/PhysRevLett.58.2059ADSCrossRef

10.

S. M. Sadat and R. Y. Wang, RSC Adv. 6 (50), 44578 (2016). https://doi.org/10.1039/C6RA03876J

11.

Y.-F. Chau, F.-L. Wu, Z.-H. Jiang, and H.-Y. Li, Opt. Express 19 (6), 4862 (2011). https://doi.org/10.1364/oe.19.004862ADSCrossRef

12.

Y. F. Chau, Opt. Commun. 282 (21), 4296 (2009). https://doi.org/10.1016/j.optcom.2009.07.033ADSCrossRef

13.

H.-F. Ho, Y.-F. Chau, H.-Y. Yeh, and F.-L. Wu, Appl. Phys. Lett. 98 (26), 263115 (2011). https://doi.org/10.1063/1.3606530ADSCrossRef

14.

M. A. Khan, J.-F. Bao, F.-H. Bao, and X. Zhou, Micromachines 10 (5), 296 (2019). https://doi.org/10.3390/mi10050296CrossRef

15.

X. Yan, Appl. Mech. Mater. 723, 778 (2015). https://doi.org/10.4028/www.scientific.net/AMM.723.778

16.

C. Y. T. Huang, et al., Nanotechnology 31 (30), 30LT01 (2020). https://doi.org/10.1088/1361-6528/AB85EECrossRef

17.

Y. Zuo-Dong and C. Jian-Chun, Chin. Phys. Lett. 22 (4), 889 (2005). https://doi.org/10.1088/0256-307X/22/4/031ADSCrossRef

18.

Y. Cheng, X. J. Liu, and D. J. Wu, J. Acoust. Soc. Am. 130 (5), 2738 (2011). https://doi.org/10.1121/1.3641365ADSCrossRef

19.

T. T. Wu, W. S. Wang, J. H. Sun, J. C. Hsu, and Y. Y. Chen, Appl. Phys. Lett. 94 (10) (2009). https://doi.org/10.1063/1.3100775

20.

Y. Jin, et al., Phys. Rev. B 93 (5) (2016). https://doi.org/10.1103/PhysRevB.93.054109

21.

H. Shao, H. He, G. Chen, and Y. Chen, Chin. J. Phys. 65, 1 (2020). https://doi.org/10.1016/j.cjph.2020.02.015CrossRef

22.

Z.-Q. Fang, Z.-L. Hou, Z.-Q. Fang, and Z.-L. Hou, Chin. Phys. Lett. 35 (5), 54601 (2018). https://doi.org/10.1088/0256-307X/35/5/054601CrossRef

23.

N. Gao, J. H. Wu, and L. Yu, Ultrasonics. 56, 287 (2015). https://doi.org/10.1016/j.ultras.2014.08.006CrossRef

24.

Z. Yang, J. Mei, M. Yang, N. H. Chan, and P. Sheng, Phys. Rev. Lett. 101 (20) (2008). https://doi.org/10.1103/PhysRevLett.101.204301

25.

A. Song, X. Wang, T. Chen, P. Jiang, and K. Bao, Int. J. Mod. Phys. B 30 (7) (2016). https://doi.org/10.1142/S0217979216500296

26.

Y. Chen, F. Qian, L. Zuo, F. Scarpa, and L. Wang, Extrem. Mech. Lett. 17, 24 (2017). https://doi.org/10.1016/j.eml.2017.09.012CrossRef

27.

S. Zuo, H. Huang, X. Wu, M. Zhang, and T. Ni, J. Acoust. Soc. Am. 143 (3), 1326 (2018). https://doi.org/10.1121/1.5025041ADSCrossRef

28.

J. Xu, et al., Phys. Rev. Appl. 19 (3), 034062 (2023). https://doi.org/10.1103/PhysRevApplied.19.034062ADSCrossRef

29.

G. Wen, H. Ou, and J. Liu, Mater. Today Commun. 24, 100977 (2020). https://doi.org/10.1016/j.mtcomm.2020.100977CrossRef

30.

E. J. P. Miranda and J. M. C. Dos Santos, Mech. Syst. Signal Process. 112, 280 (2018). https://doi.org/10.1016/J.YMSSP.2018.04.034ADSCrossRef

31.

M. A. Khan, J.-F. Bao, L. R. Zafar, F.-H. Bao, and Xin-Zhou, in Proc. IEEE Asia-Pacific Microwave Conf. (APMC) (Singapore, 2019), p. 977. https://doi.org/10.1109/APMC46564.2019.9038751

32.

P. Moradi and A. Bahrami, Chin. J. Phys. 59, 291 (2019). https://doi.org/10.1016/j.cjph.2019.03.005CrossRef

33.

M. A. Khan, J. Bao, and M. U. Farooq, J. Optoelectron. Adv. Mater. 23 (9–10), 472 (2021)

34.

M. Oudich and M. Badreddine Assouar, J. Appl. Phys. 111 (1), 014504 (2012). https://doi.org/10.1063/1.3673874ADSCrossRef

35.

R. M. De La Rue and S. A. De La Rue, in Photonic Crystals: Physics and Technology (Springer, Milan, 2008), p. 7.MATH

36.

Z. Ozer, Ferroelectrics 544 (1), 68 (2019). https://doi.org/10.1080/00150193.2019.1598187ADSCrossRef

37.

J. Li, Y. S. Wang, and C. Zhang, AIP Conf. Proc. 1233 (1), 131 (2010). https://doi.org/10.1063/1.3452095ADSCrossRef

38.

COMSOL Multiphysics® v. 5.4 (Stockholm, 2018). https://www.comsol.com.

39.

A. V. Grigor’evskiǐ, V. I. Grigor’evskiǐ, and S. A. Nikitov, Acoust. Phys. 54 (3), 289 (2008). https://doi.org/10.1134/S1063771008030019/METRICSADSCrossRef

40.

R. Lucklum, M. Zubtsov, A. Oseev, M.-P. Schmidt, S. Hirsch, and F. Hagemann, in Proc. Sensors-2013 (Baltimore, MD, 2013), p. 62. https://doi.org/10.5162/sensor2013/A3.1

41.

Y. T. Fang, J. J. Wang, and Y. X. Jiang, Acoust. Phys. 60 (2), 148 (2014). https://doi.org/10.1134/S1063771014020043/METRICSADSCrossRef

42.

N. Wang, F.-L. Hsiao, J. M. Tsai, M. Palaniapan, D.-L. Kwong, and C. Lee, J. Micromech. Microeng. 23, 65030 (2013). https://doi.org/10.1088/0960-1317/23/6/065030CrossRef

43.

G. Bing-zheng, Appl. Math. Mech. 7 (1), 25 (1986). https://doi.org/10.1007/BF01896249CrossRef

44.

N. Zhen, F.-L. Li, Y.-S. Wang, and C.-Z. Zhang, Acta Mech. Sin. 28 (4), 1143 (2012). https://doi.org/10.1007/s10409-012-0092-9ADSMathSciNetCrossRef

45.

C. Ma, J. Guo, and Y. Liu, J. Phys. Chem. Solids. 87, 95 (2015). https://doi.org/10.1016/j.jpcs.2015.07.008ADSCrossRef

46.

S. Mohammadi, et al., Electron. Lett. 43 (16), 898 (2007). https://doi.org/10.1049/el:20071159ADSCrossRef

47.

F.-H. H. Bao, et al., Sensors Actuators A: Phys. 297, 111541 (2019). https://doi.org/10.1016/j.sna.2019.111541CrossRef

48.

P. F. Hsieh, T. T. Wu, and J. H. Sun, IEEE Trans. Ultrason. Ferroelectr. Freq. Control. 53 (1), 148 (2006). https://doi.org/10.1109/TUFFC.2006.1588400CrossRef

49.

Y. Tanaka, Y. Tomoyasu, and S. I. Tamura, Phys. Rev. B—Condens. Matter Mater. Phys. 62 (11), 7387 (2000). https://doi.org/10.1103/PhysRevB.62.7387ADSCrossRef

50.

V. S. Fedotovskii, Acoust. Phys. 61 (3), 281 (2015). https://doi.org/10.1134/S1063771015020025/METRICSADSCrossRef

51.

L. R. Zafar, J. Huang, and M. A. Khan, Chin. J. Phys. 65, 481 (2020). https://doi.org/10.1016/j.cjph.2020.02.031CrossRef

52.

C. Guillén-Gallegos, H. Alva-Medrano, H. Pérez-Aguilar, A. Mendoza-Suárez, and F. Villa-Villa, Results Phys. 12, 1111 (2019). https://doi.org/10.1016/J.RINP.2018.12.072ADSCrossRef

53.

S. Jiang, H. Hu, and V. Laude, Phys. Status Solidi—Rapid Res. Lett. 12 (2), 1700317 (2018). https://doi.org/10.1002/pssr.201700317ADSCrossRef

54.

Y. Li, X. Huang, and S. Zhou, Materials (Basel) 9 (3), 186 (2016). https://doi.org/10.3390/ma9030186ADSCrossRef

55.

Y. Guo, M. Schubert, and T. Dekorsy, J. Appl. Phys. 119 (12), 124302 (2016). https://doi.org/10.1063/1.4944804ADSCrossRef

56.

B. P. Sorokin, et al., Acoust. Phys. 65 (3), 263 (2019). https://doi.org/10.1134/S1063771019030072/METRICSADSCrossRef

57.

L. I. Kazakov, Acoust. Phys. 67 (5), 451 (2021). https://doi.org/10.1134/S1063771021040047/METRICSADSCrossRef

58.

D. Feng, D. Xu, G. Wu, B. Xiong, and Y. Wang, J. Appl. Phys. 115 (2), 024503 (2014). https://doi.org/10.1063/1.4861409ADSCrossRef

59.

J. Zou, C. M. Lin, and A. P. Pisano, in Proc. IEEE Int. Joint Conf. Frequency Control Symp. & the European Frequency and Time Forum FCS-2015 (Denver, CO, 2015), p. 432. https://doi.org/10.1109/FCS.2015.7138874

60.

J. V. B. Alves, et al., in Proc. 3rd Int. Symp. on Instrumentation Systems, Circuits and Transducers INSCIT-2018 Chip in the Pampa (Rio Grande do Sul, 2018), p. 1. https://doi.org/10.1109/INSCIT.2018.8546712

61.

V. Zega, A. Frangi, A. Guercilena, and G. Gattere, Sensors 18 (7), 2157 (2018). https://doi.org/10.3390/S18072157ADSCrossRef

62.

P. Chapellier, P. Lavenus, O. Le Traon, and B. Dulmet, Microsyst. Technol. 28 (6), 1485 (2022). https://doi.org/10.1007/S00542-019-04575-0/METRICSCrossRef

63.

C. Paul, L. Pierre, D. Bernard, and L. T. Olivier, in Proc. Joint Conf. of the European Frequency and Time Forum and the IEEE Int. Frequency Control Symp. EFTF 2018 (Torino, 2018), p. 20. https://doi.org/10.1109/EFTF.2018.8408989

64.

Z. Chen, et al., Int. J. Mech. Sci. 204, 106484 (2021). https://doi.org/10.1016/J.IJMECSCI.2021.106484CrossRef

65.

G. Pillai and S. S. Li, Appl. Phys. Lett. 116 (16), 163502 (2020). https://doi.org/10.1063/5.0007418ADSCrossRef

66.

Z. Chen, et al., Sens. Actuators A: Phys. 286, 123 (2019). https://doi.org/10.1016/J.SNA.2018.12.037CrossRef

67.

S. Shahraini, H. Mansoorzare, A. Mahigir, and R. Abdolvand, J. Microelectromech. Syst. 29 (3), 296 (2020). https://doi.org/10.1109/JMEMS.2020.2972779CrossRef

68.

M. S. Arif and D. Peroulis, in Proc. IEEE/MTT-S International Microwave Symposium Digest (Montreal, 2012), p. 1. https://doi.org/10.1109/MWSYM.2012.6259684

69.

M. Salek, S. M. Hanham, and A. P. Gregory, IEEE Microw. Wirel. Compon. Lett. 33 (3), 279 (2023). https://doi.org/10.1109/LMWC.2022.3186168CrossRef

70.

W. J. Otter, S. M. Hanham, N. M. Ridler, G. Marino, N. Klein, and S. Lucyszyn, Sens. Actuators A: Phys. 217, 151 (2014). https://doi.org/10.1016/J.SNA.2014.06.022CrossRef

71.

R. C. Ng, et al., Nanoscale 14, 13428 (2022). https://doi.org/10.1039/D2NR04100FCrossRef

72.

H. Li, Y. Tian, Y. Ke, S. He, and W. Luo, in Proc. IEEE Int. Ultrasonics Symp. IUS (Chicago, 2014), p. 2533. https://doi.org/10.1109/ULTSYM.2014.0632

73.

R. H. Olsson, et al., in Proc. IEEE Int. Ultrasonics Symp. (Rome, 2009). https://doi.org/10.1109/ULTSYM.2009.5441609

74.

V. Laude, Phononic Crystals: Artificial Crystals for Sonic, Acoustic, and Elastic Waves (De Gruyter, 2015).CrossRefMATH

75.

A. Trzaskowska, P. Hakonen, M. Wiesner, and S. Mielcarek, Ultrasonics 106, 106146 (2020). https://doi.org/10.1016/j.ultras.2020.106146CrossRef

76.

K. O’Brien, N. D. Lanzillotti-Kimura, J. Rho, H. Suchowski, X. Yin, and X. Zhang, Nat. Commun. 5, 4042 (2014). https://doi.org/10.1038/ncomms5042ADSCrossRef

77.

A. H. Safavi-Naeini, et al., Nature 472 (7341), 69 (2011). https://doi.org/10.1038/nature09933ADSCrossRef

Titel: Investigation of Ultra-Wide Acoustic Bandgap of Nano Phononic Crystals in GHZ Frequency Ranges with Delay Line Configuration
verfasst von: M. A. Khan
Publikationsdatum: 01.08.2023
Verlag: Pleiades Publishing
Erschienen in: Acoustical Physics / Ausgabe 4/2023
Print ISSN: 1063-7710
Elektronische ISSN: 1562-6865
DOI: https://doi.org/10.1134/S1063771023600134

Premium Partner

Marktübersichten

Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.

Zur Marktübersicht

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Weitere Artikel der Ausgabe 4/2023

Simulation and Calculation of Undercutting Effect of the Toneholes of Woodwind Instruments on the Shift of Eigenfrequencies of the Air Duct

Mode-Matching Analysis for Sound Propagation in a Cylindrical Duct with a Partial Lining

2.5 GHz Low-Loss and Wideband Surface Acoustic Wave Filter Based on AL/128°YX-LiNbO3

Imaging of Multiple Cracks in Thin Plates using Circular Sensor Array Based on Lamb Waves

Experimental Investigations of the Influence of 3D Printing at 100% Filling on the Elastic Properties of PLA Polymer Filament Samples

Point Source of SV-Shear Waves with Vertical Polarization in a Solid Layer

Premium Partner

Marktübersichten