Ausgabe 1/2005
Inhalt (18 Artikel)
Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications
Chungho Lee, Jami Meteer, Venkat Narayanan, Edwin C. Kan
The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad
J. H. Lee, I. G. Lee, T. Kang, N. S. Kim, S. Y. Oh
Uniform Cr2+ doping of physical vapor transport grown CdSxSe1−x crystals
U. N. Roy, O. S. Babalola, J. Jones, Y. Cui, T. Mounts, A. Zavalin, S. Morgan, A. Burger
A GeSi-buffer structure for growth of high-quality GaAs epitaxial layers on a Si substrate
Edward Y. Chang, Tsung-Hsi Yang, Guangli Luo, Chun-Yen Chang
Electromigration-induced failure in flip-chip solder joints
Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, C. R. Kao
The effects of oxygen, nitrogen, and hydrogen annealing on Mg acceptors in GaN as monitored by electron paramagnetic resonance spectroscopy
D. M. Matlock, M. E. Zvanut, Haiyan Wang, Jeffrey R. Dimaio, R. F. Davis, J. E. van Nostrand, R. L. Henry, Daniel Koleske, Alma Wickenden
Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications
Hai Dong, Kyoung-Sik Moon, C. P. Wong
Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering
Ahmed Sharif, Y. C. Chan
Texture investigation of copper interconnects with a different line width
J. -Y. Cho, K. Mirpuri, D. N. Lee, J. -K. An, J. A. Szpunar
Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure
Qiu-Lian Zeng, Zhong-Guang Wang, Ai-Ping Xian, J. K. Shang
The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization
Guh-Yaw Jang, Jenq-Gong Duh
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Young-Doo Jeon, Kyung-Wook Paik, Adreas Ostmann, Herbert Reichl
Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (110) surface0) surface
Masakazu Katsuno, Noboru Ohtani, Tatsuo Fujimoto, Hirokatsu Yashiro
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding
Jihye Lee, Jung H. Kim, Choong D. Yoo
Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders
T. Laurila, V. Vuorinen, T. Mattila, J. K. Kivilahti
Correlation of in-situ reflectance spectra and resistivity of GaN/Al2O3 interfacial layer in metalorganic chemical vapor deposition
Yugang Zhou, Deliang Wang, Rongming Chu, Chak-Wah Tang, Yundong Qi, Zhengdong Lu, Kevin J. Chen, Kei May Lau
Effect of bismuth addition on sintering behavior and microwave dielectric properties of zinc titanate ceramics
Hsun-Chin Chen, Ming-Hang Weng, Jui-Hong Horng, Mau-Phon Houng, Yeong-Her Wang