Ausgabe 1/2007
Inhalt (13 Artikel)
Strength of Soldered Joints Formed under Microgravity Conditions
B. Thomas, A. Atkinson, R. J. Dashwood
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions
Y. S. Chen, C. S. Wang, T. C. Wang, W. H. Chan, K. C. Chang, T. D. Yuan
Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints
Z. Chen, M. He, A. Kumar, G.J. Qi
Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging
H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang
Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
H.T. Chen, C.Q. Wang, C. Yan, Y. Huang, Y.H. Tian
Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability
Hyoung-Joon Kim, Chang-Kyu Chung, Yong-Min Kwon, Myung-Jin Yim, Soon-Min Hong, Se-Young Jang, Young-Joon Moon, Kyung-Wook Paik
Hygrothermal Stability of Electrical Contacts Made from Silver and Graphite Electrically Conductive Pastes
Shoukai Wang, Dick S. Pang, D.D.L. Chung
Growth of Nanocrystalline ZnSe:N Films by Pulsed Laser Deposition
Tingwei Zhang, Ning Xu, Yiqun Shen, Wei Hu, Jiada Wu, Jian Sun, Zhifeng Ying
Deposition Characteristics of AlN Thin Film Prepared by the Dual Ion Beam Sputtering System
T. L. Hu, S. W. Mao, C. P. Chao, M. F. Wu, H. L. Huang, D. Gan
Phase-Change Memory Device Using Si-Sb-Te Film for Low Power Operation and Multibit Storage
Baowei Qiao, Jie Feng, Yunfeng Lai, Yanfei Cai, Yinyin Lin, Tingao Tang, Bingchu Cai, Bomy Chen
Investigation of the Surface Removal Process of Silicon Carbide in Elastic Emission Machining
Akihisa Kubota, Yohsuke Shinbayashi, Hidekazu Mimura, Yasuhisa Sano, Kouji Inagaki, Yuzo Mori, Kazuto Yamauchi